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IT3M-300P-40H03 PDF预览

IT3M-300P-40H03

更新时间: 2024-11-07 05:39:47
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
20页 1602K
描述
High-Speed(10+Gbps) BGA Mezzanine Connectors

IT3M-300P-40H03 数据手册

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NEW  
High-Speed(10+Gbps) BGA Mezzanine Connectors  
IT3 Series  
Flexibility  
Hirose’s IT3 mezzanine connector system is as  
comfortable in today’s data rates of PCIe and XAUI  
as it is in tomorrow’s 10+Gbps systems.  
With the ability to transmit differential, single-ended,  
and power through one package and being stackable  
from 15 – 40mm, IT3 can solve your interface needs  
for both current and future generations.  
Mechanical features  
Unique 3-piece structure for flexibility  
Stacking heights from 15 to 40mm  
(*15mmH is 2-piece)  
Staggered 1.5mm 1.75mm ball grid array  
Interposer  
Signal Ground  
Number of Contacts: 100, 200, &300 signals  
+ 90% additional grounds  
Differential, single-ended, and power  
Low mating/extracting forces  
Wide misalignment tolerances for multiple  
connector use  
Signal / Ground Configuration  
Both of SnPb and Pb-free are available  
Excellent reflow solderability  
Signal integrity features  
Insertion loss to Crosstalk Ratio (ICR)  
60�  
50�  
40�  
30�  
20�  
10�  
0�  
The ICR performance meets the extrapolated  
IEEE 802.3ap specification for 6.25Gbps with  
fully-populated pin assignment, and 10+Gbps  
with skipped pin assignment.  
ICR�  
IEEE spec�  
-10�  
-20�  
-30�  
-40�  
Return Loss  
The differential return loss meets the  
extrapolated IEEE 802.3ap specification  
up to 12GHz.  
RL�  
IEEE Spec�  
0�  
-50��  
0�  
0�  
5�  
10�  
15�  
20�  
5�  
10�  
15�  
20�  
Frequency (GHz)�  
Frequency (GHz)�  
Stacking height variations  
Stacking Height  
17mm  
20mm  
22mm  
25mm  
26mm  
28mm  
30mm  
32mm  
38mm  
40mm  
Contact Position  
100  
200  
300  
*
*
*
*
* : Under planning  
2010.02  
1

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