®
ispLSI 8600V
3.3V In-System Programmable
SuperBIG™ High Density PLD
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
Features
• SuperBIG HIGH DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
— 3.3V Power Supply
— 32,000 PLD Gates/600 Macrocells
— 192-264 I/O Pins Supporting 3.3V/2.5V I/O
— 864 Registers
— High-Speed Global and Big Fast Megablock (BFM)
Interconnect
— Wide 20-Macrocell Generic Logic Block (GLB) for
High Performance
— Wide Input Gating (44 Inputs per GLB) for Fast
Counters, State Machines, Address Decoders, Etc.
— PCB-Efficient Ball Grid Array (BGA) Package
Options
• HIGH-PERFORMANCE E2CMOS® TECHNOLOGY
— fmax = 125 MHz Maximum Operating Frequency
— tpd = 8.5 ns Propagation Delay
— Electrically Erasable and Reprogrammable
— Non-Volatile
Functional Block Diagram
12
12
12
12
12
I/O
12
I/O
I/O
I/O
I/O
I/O
12
I/O
12
I/O
Big Fast Megablock 0
Big Fast Megablock 1
12
I/O
12
I/O
12
I/O
12
I/O
Big Fast Megablock 2
Global Routing Plane
Big Fast Megablock 3
— Programmable Speed/Power Logic Path
Optimization
• IN-SYSTEM PROGRAMMABLE
— Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
12
I/O
12
I/O
— Reprogram Soldered Devices for Faster Debugging
12
I/O
12
I/O
Big Fast Megablock 4
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE AND
3.3V IN-SYSTEM PROGRAMMABLE
Boundary
Scan
• ARCHITECTURE FEATURES
12
12
12
12
12
12
8600v block
I/O
I/O
I/O
I/O
I/O
I/O
— Enhanced Pin-Locking Architecture, Symmetrical
Generic Logic Blocks Connected by Hierarchical
Big Fast Megablock and Global Routing Planes
— Product Term Sharing Array Supports up to 28
Product Terms per Macrocell Output
ispLSI 8000V Family Description
The ispLSI 8000V Family of Register-Intensive, 3.3V
SuperBIG In-System Programmable Logic Devices is
based on Big Fast Megablocks of 120 registered macro-
cells and a Global Routing Plane (GRP) structure
interconnecting the Big Fast Megablocks. Each Big Fast
Megablock contains 120 registered macrocells arranged
in six groups of 20, a group of 20 being referred to as a
Generic Logic Block, or GLB. Within the Big Fast
Megablock, a Big Fast Megablock Routing Pool (BRP)
interconnects the six GLBs to each other and to 24 Big
Fast Megablock I/O cells with optional I/O registers. The
Global Routing Plane which interconnects the Big Fast
Megablocks has additional global I/Os with optional I/O
registers. The 192-I/O version contains 72 Big Fast
Megablock I/O and 120 global I/O, while the 264-I/O
— Macrocells Support Concurrent Combinatorial and
Registered Functions
— Embedded Tristate Bus Can Be Used as an Internal
Tristate Bus or as an Extension of an External
Tristate Bus
— Macrocell and I/O Registers Feature Multiple Control
Options, Including Set, Reset and Clock Enable
— I/O Pins Support Programmable Bus Hold, Pull-Up,
Open-Drain and Slew Rate Options
— Separate VCCIO Power Supply to Support 3.3V or
2.5V Input/Output Logic Levels
— I/O Cell Register Programmable as Input Register for
Fast Setup Time or Output Register for Fast Clock to
Output Time
Copyright©2000LatticeSemiconductorCorp. Allbrandorproductnamesaretrademarksorregisteredtrademarksoftheirrespectiveholders. Thespecificationsandinformationhereinaresubject
to change without notice.
July 2000
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
8600v_03
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