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IS24C02D-2GLI-TR PDF预览

IS24C02D-2GLI-TR

更新时间: 2024-11-08 14:51:39
品牌 Logo 应用领域
美国芯成 - ISSI 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
21页 750K
描述
EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8

IS24C02D-2GLI-TR 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:SOIC包装说明:0.150 INCH, GREEN, SOIC-8
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.47Is Samacsys:N
最大时钟频率 (fCLK):0.4 MHz数据保留时间-最小值:100
耐久性:1000000 Write/Erase CyclesI2C控制字节:1010DDDR
JESD-30 代码:R-PDSO-G8长度:4.9 mm
内存密度:2048 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:8字数:256 words
字数代码:256工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256X8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL电源:2/5 V
认证状态:Not Qualified座面最大高度:1.75 mm
串行总线类型:I2C最大待机电流:0.000001 A
子类别:EEPROMs最大压摆率:0.003 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.8 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:3.9 mm
最长写入周期时间 (tWC):5 ms写保护:HARDWARE/SOFTWARE
Base Number Matches:1

IS24C02D-2GLI-TR 数据手册

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IS24C02D  
IS24C02D  
2-WIRE (I2C)  
2K-bit  
SERIAL EEPROM  
Copyright © 2009 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without  
notice. ISSI products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical  
equipment, aerospace or military, or other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for  
the best performance and optimization on the functionality and etc. ISSI assumes no liability arising out of the application or use of any information, products or services  
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for  
products.  
Integrated Silicon Solution, Inc. — www.issi.com  
1
Rev. C  
07/30/09  

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