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IRLI630G PDF预览

IRLI630G

更新时间: 2024-11-18 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 299K
描述
Power MOSFET(Vdss=200V, Rds(on)=0.40ohm, Id=6.2A)

IRLI630G 数据手册

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Previous Datasheet  
Index  
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PD - 9.1236  
IRLI630G  
HEXFET® Power MOSFET  
Isolated Package  
High Voltage Isolation = 2.5KVRMS  
Sink to Lead Creepage Dist. 4.8mm  
Logic-Level Gate Drive  
RDS(ON) Specified at VGS = 4V & 5V  
Fast Switching  
VDSS = 200V  
RDS(on) = 0.40Ω  
ID = 6.2A  
Ease of paralleling  
Description  
Third Generation HEXFETs from International Rectifier provide the designer  
with the best combination of fast switching, ruggedized device design, low on-  
resistance and cost-effectiveness.  
The TO-220 Fullpak eliminates the need for additional insulating hardware in  
commercial-industrial applications. The moulding compound used provides a  
high isolation capability and a low thermal resistance between the tab and external  
heatsink. This isolation is equivalent to using a 100 micron mica barrier with  
standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip  
or by a single screw fixing.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 5.0V  
Continuous Drain Current, VGS @ 5.0V  
Pulsed Drain Current  
6.2  
3.9  
A
25  
35  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.28  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±10  
Single Pulse Avalanche Energy  
Avalanche Current  
125  
mJ  
A
6.2  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
3.5  
mJ  
V/ns  
5.0  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Min.  
––––  
––––  
Typ.  
––––  
––––  
Max.  
3.6  
Units  
RθJC  
RθJA  
°C/W  
65  
To Order  
Revision 0  
 

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