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IRGC4063B PDF预览

IRGC4063B

更新时间: 2024-11-28 19:50:55
品牌 Logo 应用领域
英飞凌 - INFINEON
页数 文件大小 规格书
2页 92K
描述
Insulated Gate Bipolar Transistor,

IRGC4063B 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.84Base Number Matches:1

IRGC4063B 数据手册

 浏览型号IRGC4063B的Datasheet PDF文件第2页 
PD - 97342  
IRGC4063B  
IRGC4063B IGBT Die in Wafer Form  
Features  
• Low VCE (ON) Trench IGBT Technology  
• Low switching losses  
• Maximum Junction temperature 175 °C  
• 5 µs SCSOA  
600 V  
IC(nom) = 48A  
C
• SquareRBSOA  
• Positive VCE (ON) Temperature co-efficient  
• Tightparameterdistribution  
VCE(on) typ. = 1.65V @  
IC(nom) @ 25°C  
Motor Control IGBT  
Short Circuit Rated  
150mmWafer  
G
Benefits  
• High Efficiency in a wide range of applications  
• Suitable for a wide range of switching frequencies due  
to Low VCE (ON) and Low Switching losses  
• RuggedtransientPerformanceforincreasedreliability  
• ExcellentCurrentsharinginparalleloperation  
• Low EMI  
E
Key Electrical Characteristics (TO-247 Package)  
Parameter  
VCE(on)  
Description  
Min  
–––  
600V  
4.0V  
–––  
Typ.  
1.65V  
–––  
–––  
–––  
Max  
2.14V  
–––  
6.5V  
150µA  
± 100nA  
Test Conditions  
GE = 15V, IC = 48A, TJ =25°C  
GE = 0V, ICES = 150µA, TJ = 25°C  
CE = VGE, IC = 1400µA, TJ = 25°C  
CE = 600V, VGE = 0V, TJ = 25°C  
GE = ±20V  
Static Collector-to-Emitter On-Voltage  
Collector-to-Emitter Saturation Voltage  
Gate Threshold Voltage  
Collector-to-Emitter Leakage Current  
Gate-to-Emitter Leakage Current  
V
V
V
V
V
V(BR)CES  
VGE(th)  
ICES  
IGES  
–––  
–––  
Mechanical Data  
Nominal Back Metal Composition, Thickness:  
Nominal Front Metal Composition, Thickness:  
Dimensions:  
AI- Ti - Ni- Ag (1kA°-1kA°-4kA°-6kA°)  
Al, Si (4µm)  
4.32 mm x 5.89 mm [0.170" x 0.232"]  
150 mm  
Wafer Diameter:  
Wafer Thickness:  
70 µm typ.  
Relevant Die Mechanical Drawing Number  
Minimum Street Width  
01-5783  
75µm  
Reject Ink Dot Size  
Recommended Storage Environment:  
0.25 mm diameter minimum  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300 °C  
IRGP4063D  
Recommended Die Attach Conditions:  
Reference Packaged Part  
Die Outline  
06/05/06  

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