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IRGC5B60KB

更新时间: 2024-11-27 20:06:47
品牌 Logo 应用领域
英飞凌 - INFINEON 电动机控制晶体管
页数 文件大小 规格书
1页 14K
描述
Insulated Gate Bipolar Transistor, 600V V(BR)CES, N-Channel, 150 MM, WAFER

IRGC5B60KB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:150 MM, WAFERReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.81
集电极-发射极最大电压:600 V配置:SINGLE
JESD-30 代码:O-XUUC-N元件数量:1
封装主体材料:UNSPECIFIED封装形状:ROUND
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:MOTOR CONTROL晶体管元件材料:SILICON
Base Number Matches:1

IRGC5B60KB 数据手册

  
PD - 94408  
IRGC5B60KB  
Die in Wafer Form  
600V  
Features  
C
GEN5 Non Punch Through (NPT) Technology  
Low VCE(on)  
IC(nom)= 5A  
VCE(on) typ.=1.8V @  
IC(nom) @ 25°C  
MotorControlIGBT  
Short Circuit Rated  
150mm Wafer  
10µs Short Circuit Capability  
Square RBSOA  
Positive VCE(on) Temperature Coefficient  
G
Benefits  
Benchmark Efficiency for Motor Control Applications  
Rugged Transient Performance  
E
Excellent Current Sharing in Parallel Operation  
Qualified for Industrial Market  
Reference Standard IR Package Part: IRGS5B60KD  
Electrical Characteristics (Wafer Form)  
Parameter  
VCE (on)  
V(BR)CES  
VGE(th)  
ICES  
Description  
Guaranteed (min, max)  
1.0V min, 1.25V max  
600V min  
TestConditions  
IC = 1A, TJ = 25°C, VGE = 15V  
TJ = 25°C, ICES = 1mA, VGE = 0V  
VGE = VCE , TJ =25°C, IC = 250µA  
TJ = 25°C, VCE = 600V  
Collector-to-Emitter Saturation Voltage  
Colletor-to-Emitter Breakdown Voltage  
Gate Threshold Voltage  
3.5V min, 5.5V max  
10µA max  
Zero Gate Voltage Collector Current  
Gate-to-Emitter Leakage Current  
IGES  
± 1.1µA max  
TJ = 25°C, VGE = +/-20V  
Mechanical Data  
Nominal Backmetal Composition, (Thickness)  
Nominal Front Metal Composition, (Thickness)  
Dimensions  
Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA)  
99% Al/1% Si, (4µm)  
0.090" x 0.115"  
Wafer Diameter  
150mm, with std. < 100 > flat  
85µm, +/- 7µm  
Wafer Thickness, Tolerance  
Relevant Die Mechanical Dwg. Number  
Minimum Street Width  
01-5513  
100µm  
Reject Ink Dot Size  
0.25mm diameter minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300°C  
Ink Dot Location  
Recommended Storage Environment  
Recommended Die Attach Conditions  
Die Outline  
2.29  
[.090]  
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].  
2. CONTROLLING DIMENSION: [INCH].  
3. LETTER DESIGNATION:  
1.30  
[.051]  
S = SOURCE  
G = GAT E  
SK = SOURCE KELVIN  
IS = CURRENTSENSE  
E = EMITTER  
4. DIMENSIONAL TOLERANCES:  
BONDING PADS: < 0.635 TOLERANCE  
=
+ /- 0.013  
< [.0250] TOLERANCE = + /- [.0005]  
> 0.635 TOLERANCE + /- 0.025  
EMITTER  
WIDT H  
&
1.88 2.92  
[.074][.115]  
=
LENGTH  
> [.0250] TOLERANCE = + /- [.0010]  
0.64  
[.025]  
GAT E  
OVERALL DIE:  
WIDTH  
< 1.270 TOLERANCE = + /- 0.102  
< [.050] TOLERANCE = + /- [.004]  
> 1.270 TOLERANCE = + /- 0.203  
> [.050] TOLERANCE = + /- [.008]  
&
0.66  
[.026]  
LENGTH  
www.irf.com  
04/19/02  

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