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IRFIZ24EPBF

更新时间: 2024-11-30 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 222K
描述
HEXFET Power MOSFET

IRFIZ24EPBF 数据手册

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PD - 95594  
IRFIZ24EPbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l IsolatedPackage  
D
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l Fully Avalanche Rated  
VDSS = 60V  
R
DS(on) = 0.071Ω  
l Lead-Free  
G
Description  
ID = 14A  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
S
The TO-220 Fullpak eliminates the need for additional  
insulating hardware in commercial-industrial  
applications. The moulding compound used provides  
a high isolation capability and a low thermal resistance  
between the tab and external heatsink. This isolation  
is equivalent to using a 100 micron mica barrier with  
standard TO-220 product. The Fullpak is mounted to  
a heatsink using a single clip or by a single screw  
fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current †  
14  
9.6  
A
68  
PD @TC = 25°C  
Power Dissipation  
29  
W
W/°C  
V
Linear Derating Factor  
0.19  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚†  
Avalanche Current†  
71  
mJ  
10  
2.9  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
mJ  
5.0  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
5.2  
Units  
RθJC  
RθJA  
°C/W  
Junction-to-Ambient  
–––  
65  
07/23/04  

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