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IRFI260 PDF预览

IRFI260

更新时间: 2024-10-27 22:24:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管局域网
页数 文件大小 规格书
4页 111K
描述
TRANSISTOR N-CHANNEL(Vdss=200V, Rds(on)=0.060ohm, Id=45A*)

IRFI260 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.21Is Samacsys:N
配置:SINGLE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):45 A最大漏极电流 (ID):45 A
最大漏源导通电阻:0.07 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-259AAJESD-30 代码:R-MSFM-P3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:METAL
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):300 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:PIN/PEG
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

IRFI260 数据手册

 浏览型号IRFI260的Datasheet PDF文件第2页浏览型号IRFI260的Datasheet PDF文件第3页浏览型号IRFI260的Datasheet PDF文件第4页 
Previous Datasheet  
Index  
Next Data Sheet  
Provisional Data Sheet No. PD 9.809  
HEXFET® TRANSISTOR  
IRFI260  
N-CHANNEL  
Product Summary  
200Volt, 0.060, HEXFET  
Part Number  
BVDSS  
RDS(on)  
ID  
HEXFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transis-  
tors. The efficient geometry design achieves very  
low on-state resistance combined with high trans-  
conductance.  
IRFI260  
200V  
0.060Ω  
45A*  
Features:  
n
n
n
n
n
Hermetically Sealed  
Electrically Isolated  
Simple Drive Requirements  
Ease of Paralleling  
Ceramic Eyelets  
HEXFET transistors also feature all of the well-es-  
tablished advantages of MOSFETs, such as voltage  
control, very fast switching, ease of paralleling and  
electrical parameter temperature stability. They are  
well-suited for applications such as switching power  
supplies, motor controls, inverters, choppers, audio  
amplifiers, high energy pulse circuits and virtually  
any application where high reliability is required.  
The HEXFET transistor’s totally isolated package  
eliminates the need for additional isolating material  
between the device and the heatsink. This improves  
thermal efficiency and reduces drain capacitance.  
Absolute Maximum Ratings  
Parameter  
= 10V, T = 25°C Continuous Drain Current  
C
IRFI260  
45*  
Units  
I
D
@ V  
GS  
A
I
@ V  
= 10V, T = 100°C Continuous Drain Current  
29  
D
GS  
C
I
Pulsed Drain Current   
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
180  
DM  
@ T = 25°C  
P
300  
W
W/K ꢀ  
V
D
C
2.4  
V
±20  
GS  
E
Single Pulse Avalanche Energy ‚  
Avalanche Current   
700  
mJ  
AS  
I
45  
A
AR  
E
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt ƒ  
Operating Junction  
30  
mJ  
AR  
dv/dt  
4.3  
V/ns  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in. (1.6mm) from case for 10 sec.)  
10.9 (typical)  
* I current limited by pin diameter  
D
To Order  
 
 

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