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IRFI150A PDF预览

IRFI150A

更新时间: 2024-10-28 17:59:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲晶体管
页数 文件大小 规格书
7页 254K
描述
Power Field-Effect Transistor, 5.6A I(D), 100V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, I2PAK-3

IRFI150A 技术参数

生命周期:Obsolete包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.84
雪崩能效等级(Eas):63 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (ID):5.6 A
最大漏源导通电阻:0.4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFI150A 数据手册

 浏览型号IRFI150A的Datasheet PDF文件第2页浏览型号IRFI150A的Datasheet PDF文件第3页浏览型号IRFI150A的Datasheet PDF文件第4页浏览型号IRFI150A的Datasheet PDF文件第5页浏览型号IRFI150A的Datasheet PDF文件第6页浏览型号IRFI150A的Datasheet PDF文件第7页 
IRFW/I510A  
Advanced Power MOSFET  
FEATURES  
BVDSS = 100 V  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
W
RDS(on) = 0.4  
ID = 5.6 A  
Improved Gate Charge  
Extended Safe Operating Area  
D2-PAK  
I2-PAK  
O
C
175 Operating Temperature  
2
m
Lower Leakage Current : 10 A (Max.) @ VDS = 100V  
W
Lower RDS(ON) : 0.289 (Typ.)  
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Drain-to-Source Voltage  
Value  
100  
5.6  
4
Units  
VDSS  
V
O
Continuous Drain Current (TC=25 C)  
ID  
A
O
Continuous Drain Current (TC=100 C)  
1
IDM  
VGS  
EAS  
IAR  
Drain Current-Pulsed  
20  
A
V
O
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
+
_
20  
63  
2
mJ  
A
O
1
5.6  
3.3  
6.5  
3.8  
33  
O
EAR  
dv/dt  
1
Repetitive Avalanche Energy  
mJ  
V/ns  
W
O
3
Peak Diode Recovery dv/dt  
O
O
*
)
Total Power Dissipation (TA=25  
Total Power Dissipation (TC=25  
Linear Derating Factor  
C
O
PD  
)
C
W
O
0.22  
W/ C  
Operating Junction and  
TJ , TSTG  
- 55 to +175  
Storage Temperature Range  
O
C
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from case for 5-seconds  
TL  
300  
Thermal Resistance  
Symbol  
Characteristic  
Typ.  
Max.  
Units  
Rq  
Junction-to-Case  
--  
--  
--  
4.51  
40  
JC  
O
Rq  
*
Junction-to-Ambient  
Junction-to-Ambient  
/W  
C/  
JA  
Rq  
62.5  
JA  
*
When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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