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IRF9Z24NL PDF预览

IRF9Z24NL

更新时间: 2024-11-17 22:26:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 170K
描述
Power MOSFET(Vdss=-55V, Rds(on)=0.175ohm, Id=-12A)

IRF9Z24NL 数据手册

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PD - 91742A  
IRF9Z24NS/L  
HEXFET® Power MOSFET  
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Advanced Process Technology  
Surface Mount (IRF9Z24NS)  
Low-profile through-hole (IRF9Z24NL)  
175°C Operating Temperature  
P-Channel  
D
VDSS = -55V  
RDS(on) = 0.175Ω  
G
Fast Switching  
Fully Avalanche Rated  
ID = -12A  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedizeddevicedesignthatHEXFETPowerMOSFETs  
arewellknownfor,providesthedesignerwithanextremely  
efficient and reliable device for use in a wide variety of  
applications.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of  
its low internal connection resistance and can dissipate  
up to 2.0W in a typical surface mount application.  
The through-hole version (IRF9Z24NL) is available for  
low-profile applications.  
2
T O -262  
D
Pak  
Absolute Maximum Ratings  
Parameter  
Max.  
-12  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10Vꢀ  
Continuous Drain Current, VGS @ -10Vꢀ  
Pulsed Drain Current ꢀ  
-8.5  
-48  
A
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
3.8  
W
W
Power Dissipation  
45  
Linear Derating Factor  
0.30  
± 20  
96  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚ꢀ  
Avalanche Current  
mJ  
A
-7.2  
4.5  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
mJ  
V/ns  
-5.0  
-55 to + 175  
300 (1.6mm from case )  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient ( PCB Mounted,steady-state)**  
Typ.  
–––  
Max.  
3.3  
40  
Units  
RθJC  
°C/W  
RθJA  
–––  
www.irf.com  
1
7/16/99  

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