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IRF634NS PDF预览

IRF634NS

更新时间: 2024-11-24 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 301K
描述
Power MOSFET(Vdss=250V, Rds(on)=0.435ohm, Id=8.0A)

IRF634NS 数据手册

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PD - 94310  
IRF634N  
IRF634NS  
IRF634NL  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Ease of Paralleling  
HEXFET® Power MOSFET  
D
VDSS = 250V  
R
DS(on) = 0.435Ω  
l Simple Drive Requirements  
Description  
G
FifthGenerationHEXFET®PowerMOSFETsfromInternational  
Rectifier utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combinedwiththefastswitchingspeedandruggedizeddevice  
design that HEXFET Power MOSFETs are well known for,  
provides the designer with an extremely efficient and reliable  
device for use in a wide variety of applications.  
ID = 8.0A  
S
TheTO-220packageisuniversallypreferredforallcommercial-  
industrial applications at power dissipation levels to  
approximately 50 watts. The low thermal resistance and low  
package cost of the TO-220 contribute to its wide acceptance  
throughout the industry.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in any  
existingsurfacemountpackage. TheD2Pakissuitableforhigh  
current applications because of its low internal connection  
resistance and can dissipate up to 2.0W in a typical surface  
mount application.  
D2Pak  
IRF634NS  
TO-262  
IRF634NL  
TO-220AB  
IRF634N  
The through-hole version (IRF634NL) is available for low-  
profile application.  
Absolute Maximum Ratings  
Parameter  
Max.  
8.0  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
5.6  
32  
PD @TC = 25°C  
PD @TA = 25°C  
Power Dissipation  
88  
W
Power Dissipationꢀ  
3.8  
Linear Derating Factor  
0.59  
± 20  
110  
4.8  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
8.8  
mJ  
V/ns  
7.3  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew„  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
www.irf.com  
1
9/10/01  

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