PD - 94310
IRF634N
IRF634NS
IRF634NL
l Advanced Process Technology
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Ease of Paralleling
HEXFET® Power MOSFET
D
VDSS = 250V
R
DS(on) = 0.435Ω
l Simple Drive Requirements
Description
G
FifthGenerationHEXFET®PowerMOSFETsfromInternational
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combinedwiththefastswitchingspeedandruggedizeddevice
design that HEXFET Power MOSFETs are well known for,
provides the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
ID = 8.0A
S
TheTO-220packageisuniversallypreferredforallcommercial-
industrial applications at power dissipation levels to
approximately 50 watts. The low thermal resistance and low
package cost of the TO-220 contribute to its wide acceptance
throughout the industry.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in any
existingsurfacemountpackage. TheD2Pakissuitableforhigh
current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface
mount application.
D2Pak
IRF634NS
TO-262
IRF634NL
TO-220AB
IRF634N
The through-hole version (IRF634NL) is available for low-
profile application.
Absolute Maximum Ratings
Parameter
Max.
8.0
Units
A
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
5.6
32
PD @TC = 25°C
PD @TA = 25°C
Power Dissipation
88
W
Power Dissipationꢀ
3.8
Linear Derating Factor
0.59
± 20
110
4.8
W/°C
V
VGS
EAS
IAR
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
8.8
mJ
V/ns
7.3
-55 to +175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
°C
300 (1.6mm from case )
10 lbf•in (1.1N•m)
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