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IRF1104S

更新时间: 2024-11-20 21:53:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 211K
描述
HEXFET Power MOSFET

IRF1104S 数据手册

 浏览型号IRF1104S的Datasheet PDF文件第2页浏览型号IRF1104S的Datasheet PDF文件第3页浏览型号IRF1104S的Datasheet PDF文件第4页浏览型号IRF1104S的Datasheet PDF文件第5页浏览型号IRF1104S的Datasheet PDF文件第6页浏览型号IRF1104S的Datasheet PDF文件第7页 
PD-91845  
IRF1104S/L  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Surface Mount (IRF1104S)  
l Low-profile through-hole (IRF1104L)  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS = 40V  
RDS(on) = 0.009Ω  
G
ID = 100Aꢀ  
l Fully Avalanche Rated  
S
Description  
FifthGenerationHEXFETsfromInternationalRectifierutilize  
advancedprocessingtechniquestoachieveextremelylow  
on-resistancepersiliconarea. Thisbenefit,combinedwith  
thefastswitchingspeedandruggedizeddevicedesignthat  
HEXFETPowerMOSFETsarewellknownfor,providesthe  
designerwithanextremelyefficientandreliabledevicefor  
useinawidevarietyofapplications.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highestpowercapabilityandthelowestpossibleon-resistance  
in any existing surface mount package. The D2Pak is  
suitable for high current applications because of its low  
internalconnectionresistanceandcandissipateupto2.0W  
inatypicalsurfacemountapplication.  
2
T O -262  
D
Pak  
Thethrough-holeversion(IRF1104L)isavailableforlow-  
profileapplications.  
Absolute Maximum Ratings  
Parameter  
Max.  
100†  
71†  
400  
2.4  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10Vꢀ  
Continuous Drain Current, VGS @ 10Vꢀ  
Pulsed Drain Current ꢀ  
A
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
W
W
Power Dissipation  
170  
1.1  
Linear Derating Factor  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±20  
350  
60  
Single Pulse Avalanche Energy‚ꢀ  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
17  
mJ  
V/ns  
5.0  
-55 to + 175  
300 (1.6mm from case )  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient(PCB Mounted,steady-state)**  
Typ.  
–––  
Max.  
0.9  
62  
Units  
RθJC  
°C/W  
RθJA  
–––  
www.irf.com  
1
11/20/98  

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