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IR350DM12CCBPBF PDF预览

IR350DM12CCBPBF

更新时间: 2024-11-08 05:55:35
品牌 Logo 应用领域
英飞凌 - INFINEON 二极管
页数 文件大小 规格书
3页 110K
描述
Rectifier Diode, 1 Phase, 1 Element, 1200V V(RRM), Silicon, WAFER

IR350DM12CCBPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:O-XUUC-NReach Compliance Code:compliant
HTS代码:8541.10.00.40风险等级:5.52
应用:GENERAL PURPOSE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.96 VJESD-30 代码:O-XUUC-N
元件数量:1相数:1
封装主体材料:UNSPECIFIED封装形状:ROUND
封装形式:UNCASED CHIP峰值回流温度(摄氏度):260
认证状态:Not Qualified最大重复峰值反向电压:1200 V
子类别:Rectifier Diodes表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:40Base Number Matches:1

IR350DM12CCBPBF 数据手册

 浏览型号IR350DM12CCBPBF的Datasheet PDF文件第2页浏览型号IR350DM12CCBPBF的Datasheet PDF文件第3页 
Bulletin I0123J rev. A 02/97  
IR350DM..CCB SERIES  
STANDARD RECOVERY DIODES  
Junction Size:  
Wafer Size:  
Square 350 mils  
4"  
VRRM Class:  
800 and 1200 V  
Passivation Process:  
Glassivated MOAT  
Reference IR Packaged Part: IRKD71 Series  
Major Ratings and Characteristics  
Parameters  
Units  
TestConditions  
VFM  
Maximum Forward Voltage  
960 mV  
TJ = 25°C, IF = 25 A  
VRRM Reverse Breakdown Voltage Range  
800 and 1200 V TJ = 25°C, IRRM = 100 µA  
(1)  
(1)Nitrogen flow on die edge.  
Mechanical Characteristics  
Nominal Back Metal Composition, Thickness  
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)  
100% Al, (20 µm)  
Nominal Front Metal Composition, Thickness  
Chip Dimensions  
350 x 350 mils (see drawing)  
100 mm, with std. < 110 > flat  
300 µm, ± 10 µm  
Wafer Diameter  
Wafer Thickness  
Maximum Width of Sawing Line  
Reject Ink Dot Size  
45 µm  
0.25 mm diameter minimum  
Seedrawing  
Ink Dot Location  
Recommended Storage Environment  
Storage in original container, in dessicated  
nitrogen,withnocontamination  
www.irf.com  
1

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