( )&(PbF)
IR2111 S
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions. Additional information is shown in figures 7 through 10.
Symbol
Definition
Min.
Max.
Units
V
V
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
-0.3
625
B
S
V
- 25
V
V
+ 0.3
+ 0.3
25
B
B
B
V
V
V
- 0.3
S
HO
V
-0.3
-0.3
-0.3
—
CC
V
V
V
+ 0.3
+ 0.3
LO
CC
V
Logic input voltage
IN
CC
dV /dt
s
Allowable offset supply voltage transient (figure 2)
50
V/ns
W
P
Package power dissipation @ T ≤ +25°C (8 Lead PDIP)
—
1.0
0.625
125
200
150
150
300
D
A
(8 lead SOIC)
—
Rth
Thermal resistance, junction to ambient
(8 lead PDIP)
(8 lead SOIC)
—
JA
°C/W
°C
—
T
Junction temperature
—
J
T
Storage temperature
-55
—
S
T
Lead temperature (soldering, 10 seconds)
L
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.
S
Symbol
Definition
Min.
Max.
Units
V
V
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
V
+ 10
V + 20
S
B
S
S
Note 1
600
V
HO
V
V
B
S
V
V
CC
10
0
20
V
LO
V
CC
CC
V
Logic input voltage
0
V
IN
°C
T
A
Ambient temperature
-40
125
Note 1: Logic operational for V of -5 to +600V. Logic state held for V of -5V to -V . (Please refer to the Design Tip
S
S
BS
DT97-3 for more details).
2
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