Material Content Data Sheet
Sales Product Name IPU60R1K4C6
Issued
29. September 2015
MA#
MA001348748
Package
PG-TO251-3-341
Weight*
387.64 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
1.624
0.248
0.42
0.06
0.02
64.03
0.11
0.10
3.07
30.60
0.98
0.13
0.01
0.01
0.46
0.42
4190
641
4190
leadframe
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
0.075
192
248.124
0.439
64.11
0.11
640080
1134
1013
30739
306044
9769
1329
122
640913
1134
wire
encapsulation
0.393
11.916
118.636
3.787
inorganic material
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
33.77
0.98
0.13
337796
9769
leadfinish
plating
nickel
0.515
1329
solder
silver
0.047
non noble metal
non noble metal
< 10%
tin
0.038
97
lead
1.802
0.48
4650
4869
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com