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IPU60R2K0C6_15 PDF预览

IPU60R2K0C6_15

更新时间: 2024-09-26 01:18:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
1页 32K
描述
Material Content Data Sheet

IPU60R2K0C6_15 数据手册

  
Material Content Data Sheet  
Sales Product Name IPU60R2K0C6  
Issued  
29. September 2015  
MA#  
MA001402334  
Package  
PG-TO251-3-341  
Weight*  
387.39 mg  
Average  
Mass  
[%]  
Average  
CAS#  
Weight  
[mg]  
Sum  
[%]  
Sum  
Construction Element  
Material Group  
Substances  
Mass  
[ppm]  
if applicable  
[ppm]  
chip  
inorganic material  
non noble metal  
inorganic material  
non noble metal  
non noble metal  
organic material  
plastics  
silicon  
7440-21-3  
7439-89-6  
7723-14-0  
7440-50-8  
7429-90-5  
1333-86-4  
-
1.272  
0.248  
0.33  
0.06  
0.02  
64.06  
0.11  
0.10  
3.08  
30.71  
0.98  
0.13  
0.01  
0.01  
0.40  
0.33  
3282  
641  
3282  
leadframe  
iron  
phosphorus  
copper  
aluminium  
carbon black  
epoxy resin  
silicondioxide  
tin  
0.075  
192  
248.124  
0.441  
64.14  
0.11  
640508  
1138  
1017  
30843  
307076  
9775  
1330  
105  
641341  
1138  
wire  
encapsulation  
0.394  
11.948  
118.957  
3.787  
inorganic material  
non noble metal  
non noble metal  
noble metal  
60676-86-0  
7440-31-5  
7440-02-0  
7440-22-4  
7440-31-5  
7439-92-1  
33.89  
0.98  
0.13  
338936  
9775  
leadfinish  
plating  
nickel  
0.515  
1330  
solder  
silver  
0.041  
non noble metal  
non noble metal  
< 10%  
tin  
0.033  
84  
lead  
1.553  
0.42  
4009  
4198  
*deviation  
Sum in total: 100.00  
1000000  
Important Remarks:  
1.  
2.  
3.  
Infineon Technologies AG provides full material declaration based on information provided by third parties and  
has taken and continues to take reasonable steps to provide representative and accurate information.  
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited information may not be available for release.  
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any  
time due to technical requirements and development without notification.  
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption  
7a, Lead in high melting temperature type solders.  
Company  
Address  
Internet  
Infineon Technologies AG  
81726 München  
www.infineon.com  

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