600VꢀCoolMOSªꢀCEꢀPowerꢀTransistor
IPD60R1K5CE,ꢀIPU60R1K5CE
1ꢀꢀꢀꢀꢀMaximumꢀratings
atꢀTjꢀ=ꢀ25°C,ꢀunlessꢀotherwiseꢀspecified
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings
Values
Typ.
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
-
-
-
-
5
3.2
TC=25°C
A
Continuous drain current1)
ID
TC=100°C
Pulsed drain current2)
ID,pulse
EAS
-
-
-
-
-
-
-
-
8
A
TC=25°C
Avalanche energy, single pulse
Avalanche energy, repetitive
Avalanche current, repetitive
MOSFET dv/dt ruggedness
Gate source voltage (static)
Gate source voltage (dynamic)
-
26
0.09
0.6
50
20
30
mJ
mJ
A
ID=0.6A; VDD=50V; see table 11
EAR
-
ID=0.6A; VDD=50V; see table 11
-
IAR
-
dv/dt
VGS
VGS
-
V/ns VDS=0...480V
-20
-30
V
V
static;
AC (f>1 Hz)
Power dissipation
TO-251, TO252
Ptot
-
-
49
W
TC=25°C
Storage temperature
Tstg
Tj
-40
-40
-
-
-
-
-
150
150
3.5
8
°C
°C
A
-
Operating junction temperature
Continuous diode forward current
Diode pulse current2)
-
IS
TC=25°C
TC=25°C
IS,pulse
-
A
VDS=0...400V,ꢀISD<=IS,ꢀTj=25°Cꢀꢀꢀꢀꢀꢀꢀꢀ
see table 9
Reverse diode dv/dt3)
dv/dt
dif/dt
-
-
-
-
15
V/ns
VDS=0...400V,ꢀISD<=IS,ꢀTj=25°Cꢀꢀꢀꢀꢀꢀꢀꢀ
see table 9
Maximum diode commutation speed
500
A/µs
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristicsꢀꢀTO-251,ꢀTO252
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Typ.
Max.
2.57
62
Thermal resistance, junction - case
RthJC
-
-
-
-
°C/W -
Thermal resistance, junction - ambient RthJA
°C/W leaded
Soldering temperature, wavesoldering
only allowed at leads
Tsold
-
-
260
°C
1.6mm (0.063 in.) from case for 10s
1) Limited by Tj max. Maximum duty cycle D=0.50
2) Pulse width tp limited by Tj,max
3)ꢀIdenticalꢀlowꢀsideꢀandꢀhighꢀsideꢀswitchꢀwithꢀidenticalꢀRG
Final Data Sheet
3
2016-03-31