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INA111AU/1KG4 PDF预览

INA111AU/1KG4

更新时间： 2024-02-08 07:18:52
品牌 Logo 应用领域
BB 仪表放大器光电二极管
页数 文件大小 规格书
14页 242K
描述
High Speed FET-Input INSTRUMENTATION AMPLIFIER

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中文翻译

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INA111AU/1KG4 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：SOIC
包装说明：SOIC-16针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：6 weeks
风险等级：5.13Is Samacsys：N
放大器类型：INSTRUMENTATION AMPLIFIER最大平均偏置电流 (IIB)：0.00002 µA
标称带宽 (3dB)：2 MHz最小共模抑制比：75 dB
最大输入失调电流 (IIO)：0.00001 µA最大输入失调电压：6000 µV
JESD-30 代码：R-PDSO-G16JESD-609代码：e4
长度：10.3 mm湿度敏感等级：3
负供电电压上限：-18 V标称负供电电压 (Vsup)：-15 V
最大非线性：0.04%功能数量：1
端子数量：16最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP16,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
包装方法：TR峰值回流温度（摄氏度）：260
电源：+-15 V认证状态：Not Qualified
座面最大高度：2.65 mm标称压摆率：17 V/us
子类别：Instrumentation Amplifier最大压摆率：4.5 mA
供电电压上限：18 V标称供电电压 (Vsup)：15 V
表面贴装：YES温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED最大电压增益：10000
最小电压增益：1标称电压增益：10
宽度：7.5 mmBase Number Matches：1

INA111AU/1KG4 数据手册

 浏览型号INA111AU/1KG4的Datasheet PDF文件第8页浏览型号INA111AU/1KG4的Datasheet PDF文件第9页浏览型号INA111AU/1KG4的Datasheet PDF文件第10页浏览型号INA111AU/1KG4的Datasheet PDF文件第11页浏览型号INA111AU/1KG4的Datasheet PDF文件第13页浏览型号INA111AU/1KG4的Datasheet PDF文件第14页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2007  
PACKAGING INFORMATION  
Orderable Device  
INA111AP  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
P
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
INA111APG4  
INA111AU  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
P
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
P
16  
16  
16  
16  
16  
8
48  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
INA111AU/1K  
INA111AU/1KE4  
INA111AU/1KG4  
INA111AUE4  
INA111BP  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
1000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
48  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
INA111BPG4  
INA111BU  
P
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DW  
DW  
16  
16  
48  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
INA111BUE4  
48  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
Addendum-Page 1  
1...91011121314

中文翻译

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