3.3 VOLT HIGH-DENSITY SUPERSYNC II™
36-BIT FIFO
65,536 x 36
131,072 x 36
IDT72V36100
IDT72V36110
• Empty, Full and Half-Full flags signal FIFO status
• Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
• Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
• Program programmable flags by either serial or parallel means
• Select IDT Standard timing (using EF and FF flags) or First Word
Fall Through timing (using OR and IR flags)
• Output enable puts data outputs into high impedance state
• Easily expandable in depth and width
• JTAG port, provided for Boundary Scan function (PBGA Only)
• Independent Read and Write Clocks (permit reading and writing
simultaneously)
• Availableina128-pinThinQuadFlatPack(TQFP)ora144-pinPlastic
Ball Grid Array (PBGA) (with additional features)
• Pin compatible to the SuperSync II (IDT72V3640/72V3650/72V3660/
72V3670/72V3680/72V3690)family
FEATURES:
• Choose among the following memory organizations:
IDT72V36100 ⎯ 65,536 x 36
IDT72V36110 ⎯ 131,072 x 36
• Higher density, 2Meg and 4Meg SuperSync II FIFOs
• Up to 166 MHz Operation of the Clocks
• UserselectableAsynchronous readand/orwriteports (PBGAOnly)
• User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
• Big-Endian/Little-Endian user selectable byte representation
• 5V input tolerant
• Fixed, low first word latency
• Zero latency retransmit
• Auto power down minimizes standby power consumption
• Master Reset clears entire FIFO
• High-performance submicron CMOS technology
• Industrial temperature range (–40°C to +85°C) is available
• Green parts available, see ordering information
• Partial Reset clears data, but retains programmable settings
FUNCTIONALBLOCKDIAGRAM
*Available on the PBGA package only.
D0 -Dn (x36, x18 or x9)
LD SEN
WEN
WCLK/WR
*
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
FLAG
LOGIC
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
WRITE CONTROL
LOGIC
ASYW
*
RAM ARRAY
65,536 x 36
131,072 x 36
WRITE POINTER
READ POINTER
BE
CONTROL
LOGIC
IP
RT
RM
ASYR
READ
CONTROL
LOGIC
BM
IW
OW
OUTPUT REGISTER
BUS
*
CONFIGURATION
MRS
PRS
RESET
LOGIC
RCLK/RD
*
REN
TCK
*
*
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
6117 drw01
*
Q0 -Qn (x36, x18 or x9)
OE
*
*
IDTandtheIDTlogoaretrademarksofIntegratedDeviceTechnology,Inc.TheSuperSyncIIFIFOisatrademarkofIntegratedDeviceTechnology,Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
APRIL 2006
1
©
2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-6117/13