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IDT72V2103L6BCG PDF预览

IDT72V2103L6BCG

更新时间: 2024-11-21 15:44:43
品牌 Logo 应用领域
艾迪悌 - IDT 时钟LTE先进先出芯片内存集成电路
页数 文件大小 规格书
46页 371K
描述
FIFO, 128KX18, 4ns, Synchronous, CMOS, PBGA100, GREEN, 11 X 11 MM, 1 MM PITCH, BGA-100

IDT72V2103L6BCG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:LBGA, BGA100,10X10,40针数:100
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.26
最长访问时间:4 ns其他特性:ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
备用内存宽度:9最大时钟频率 (fCLK):166 MHz
周期时间:6 nsJESD-30 代码:S-PBGA-B100
JESD-609代码:e1长度:11 mm
内存密度:2359296 bit内存集成电路类型:OTHER FIFO
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:100
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX18
可输出:YES封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA100,10X10,40
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.5 mm最大待机电流:0.015 A
子类别:FIFOs最大压摆率:0.035 mA
最大供电电压 (Vsup):3.45 V最小供电电压 (Vsup):3.15 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:11 mm
Base Number Matches:1

IDT72V2103L6BCG 数据手册

 浏览型号IDT72V2103L6BCG的Datasheet PDF文件第2页浏览型号IDT72V2103L6BCG的Datasheet PDF文件第3页浏览型号IDT72V2103L6BCG的Datasheet PDF文件第4页浏览型号IDT72V2103L6BCG的Datasheet PDF文件第5页浏览型号IDT72V2103L6BCG的Datasheet PDF文件第6页浏览型号IDT72V2103L6BCG的Datasheet PDF文件第7页 
3.3 VOLT HIGH-DENSITY SUPERSYNC II™  
NARROW BUS FIFO  
131,072 x 18/262,144 x 9  
262,144 x 18/524,288 x 9  
IDT72V2103  
IDT72V2113  
FEATURES:  
Empty, Full and Half-Full flags signal FIFO status  
Programmable Almost-Empty and Almost-Full flags, each flag can  
default to one of eight preselected offsets  
Selectable synchronous/asynchronous timing modes for Almost-  
Empty and Almost-Full flags  
Program programmable flags by either serial or parallel means  
Select IDT Standard timing (using EF and FF flags) or First Word  
Fall Through timing (using OR and IR flags)  
Output enable puts data outputs into high impedance state  
Easily expandable in depth and width  
JTAG port, provided for Boundary Scan function (BGA Only)  
Independent Read and Write Clocks (permit reading and writing  
simultaneously)  
Choose among the following memory organizations:  
IDT72V2103  
IDT72V2113  
131,072 x 18/262,144 x 9  
262,144 x 18/524,288 x 9  
Functionally compatible with the IDT72V255LA/72V265LA and  
IDT72V275/72V285 SuperSync FIFOs  
Up to 166 MHz Operation of the Clocks  
User selectable Asynchronous read and/or write ports (BGA Only)  
7.5 ns read/write cycle time (5.0 ns access time)  
User selectable input and output port bus-sizing  
- x9 in to x9 out  
- x9 in to x18 out  
- x18 in to x9 out  
- x18 in to x18 out  
Big-Endian/Little-Endian user selectable byte representation  
5V tolerant inputs  
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball  
Grid Array (BGA) (with additional features)  
Pin compatible to the SuperSync II (IDT72V223/72V233/72V243/  
72V253/72V263/72V273/72V283/72V293)family  
Fixed, low first word latency  
Zero latency retransmit  
Auto power down minimizes standby power consumption  
Master Reset clears entire FIFO  
High-performance submicron CMOS technology  
Industrial temperature range (–40°C to +85°C) is available  
Green parts available, see ordering information  
Partial Reset clears data, but retains programmable settings  
FUNCTIONAL BLOCK DIAGRAM  
D0 -Dn (x9 or x18)  
LD SEN  
*Available on the  
WEN WCLK/WR  
*
BGA package only.  
INPUT REGISTER  
OFFSET REGISTER  
FF/IR  
PAF  
EF/OR  
PAE  
FLAG  
LOGIC  
WRITE CONTROL  
LOGIC  
ASYW  
HF  
*
RAM ARRAY  
FWFT/SI  
PFM  
131,072 x 18 or 262,144 x 9  
262,144 x 18 or 524,288 x 9  
FSEL0  
FSEL1  
WRITE POINTER  
READ POINTER  
BE  
CONTROL  
LOGIC  
IP  
RT  
RM  
ASYR  
READ  
CONTROL  
LOGIC  
OUTPUT REGISTER  
IW  
OW  
BUS  
*
CONFIGURATION  
MRS  
PRS  
RESET  
LOGIC  
RCLK/RD  
*
REN  
TCK  
*
*
TRST  
TMS  
TDI  
TDO  
JTAG CONTROL  
(BOUNDARY  
SCAN)  
*
6119 drw01  
*
Q0 -Qn (x9 or x18)  
OE  
*
*
IDTandtheIDTlogoareregisteredtrademarksofIntegratedDeviceTechnology,Inc.SuperSyncIIFIFOisatrademarkofIntegratedDeviceTechnology,Inc.  
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES  
OCTOBER 22, 2008  
1
©
2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-6119/14  

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