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IDT71V67802S133BGI PDF预览

IDT71V67802S133BGI

更新时间: 2024-02-21 11:47:03
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
23页 515K
描述
Cache SRAM, 512KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IDT71V67802S133BGI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:14 X 22 MM, PLASTIC, BGA-119
针数:119Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:4.2 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B119
JESD-609代码:e0长度:22 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:119
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5,3.3 V认证状态:Not Qualified
座面最大高度:2.36 mm最大待机电流:0.07 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.28 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn63Pb37)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

IDT71V67802S133BGI 数据手册

 浏览型号IDT71V67802S133BGI的Datasheet PDF文件第2页浏览型号IDT71V67802S133BGI的Datasheet PDF文件第3页浏览型号IDT71V67802S133BGI的Datasheet PDF文件第4页浏览型号IDT71V67802S133BGI的Datasheet PDF文件第5页浏览型号IDT71V67802S133BGI的Datasheet PDF文件第6页浏览型号IDT71V67802S133BGI的Datasheet PDF文件第7页 
256K X 36, 512K X 18  
3.3VSynchronousSRAMs  
2.5V I/O, Burst Counter  
IDT71V67602  
IDT71V67802  
PipelinedOutputs,SingleCycleDeselect  
Features  
Description  
256K x 36, 512K x 18 memory configurations  
Supports high system speed:  
The IDT71V67602/7802 are high-speed SRAMs organized as  
256K x 36/512K x 18. The IDT71V676/78 SRAMs contain write, data,  
addressandcontrolregisters. InternallogicallowstheSRAMtogenerate  
aself-timedwritebaseduponadecisionwhichcanbeleftuntiltheendof  
thewritecycle.  
– 166MHz 3.5ns clock access time  
– 150MHz 3.8ns clock access time  
– 133MHz 4.2ns clock access time  
LBO input selects interleaved or linear burst mode  
Self-timed write cycle with global write control (GW), byte  
write enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
2.5V I/O supply (VDDQ)  
Packaged in a JEDEC Standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch  
ball grid array.  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V67602/7802canprovidefourcyclesof  
dataforasingleaddresspresentedtotheSRAM. Aninternalburstaddress  
counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
accesssequence.Thefirstcycleofoutputdatawillbepipelinedforone  
cycle before it is available on the next rising clock edge. If burst mode  
operationisselected(ADV=LOW),thesubsequentthreecyclesofoutput  
datawillbeavailabletotheuseronthenextthreerisingclockedges. The  
orderofthesethreeaddressesaredefinedbytheinternalburstcounter  
andthe LBO inputpin.  
TheIDT71V67602/7802SRAMsutilizeIDT’slatesthigh-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pinthinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and 165 fine pitch ball grid array (fBGA).  
PinDescriptionSummary  
A0-A18  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enable  
CE  
0
1
CS , CS  
Chip Selects  
Output Enable  
OE  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
Clock  
GW  
BWE  
1
(1)  
2
3
4
BW , BW , BW , BW  
CLK  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Sleep Mode  
Synchronous  
Synchronous  
Synchronous  
DC  
ADV  
ADSC  
ADSP  
LBO  
ZZ  
Asynchronous  
Synchronous  
N/A  
I/O0-I/O31, I/OP1-I/OP4  
VDD, VDDQ  
VSS  
Data Input / Output  
Core Power, I/O Power  
Ground  
Supply  
Supply  
N/A  
5311 tbl 01  
NOTE:  
1. BW3 and BW4 are not applicable for the IDT71V67802.  
APRIL 2003  
1
©2002IntegratedDeviceTechnology,Inc.  
DSC-5311/06  

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