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IDT71V67613S183BQ PDF预览

IDT71V67613S183BQ

更新时间: 2024-11-08 07:47:03
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器
页数 文件大小 规格书
23页 510K
描述
Cache SRAM, 256KX36, 3.3ns, CMOS, PBGA165, 13 X 15 MM, FINE PITCH, BGA-165

IDT71V67613S183BQ 数据手册

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256K X 36, 512K X 18  
3.3VSynchronousSRAMs  
3.3V I/O, Burst Counter  
Advance  
Information  
IDT71V67613  
IDT71V67813  
PipelinedOutputs,SingleCycleDeselect  
256K x 36/512K x 18. The IDT71V67613/7813 SRAMs contain write,  
data, address and control registers. Internal logic allows the SRAM to  
generateaself-timedwritebaseduponadecisionwhichcanbeleftuntil  
theendofthewritecycle.  
Features  
256K x 36, 512K x 18 memory configurations  
Supports high system speed:  
– 200MHz 3.1ns clock access time  
– 183MHz 3.3ns clock access time  
LBO input selects interleaved or linear burst mode  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V67613/7813canprovidefourcyclesof  
dataforasingleaddresspresentedtotheSRAM. Aninternalburstaddress  
counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
accesssequence.Thefirstcycleofoutputdatawillbepipelinedforone  
cycle before it is available on the next rising clock edge. If burst mode  
operationisselected(ADV=LOW),thesubsequentthreecyclesofoutput  
datawillbeavailabletotheuseronthenextthreerisingclockedges. The  
orderofthesethreeaddressesaredefinedbytheinternalburstcounter  
andthe LBO inputpin.  
Self-timed write cycle with global write control (GW), byte  
write enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
3.3V I/O supply (VDDQ)  
Packaged in a JEDEC Standard 100-pin thin plastic quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch  
ball grid array (fBGA).  
TheIDT71V67613/7813SRAMsutilizeIDT’slatesthigh-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pin thin plasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and 165 fine pitch ball grid array (fBGA).  
Description  
The IDT71V67613/7813 are high-speed SRAMs organized as  
PinDescriptionSummary  
0
18  
A -A  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
I/O  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enable  
CE  
0
1
CS , CS  
Chip Selects  
Output Enable  
OE  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
Clock  
GW  
BWE  
1
(1)  
2
3
4
BW , BW , BW , BW  
CLK  
ADV  
ADSC  
ADSP  
LBO  
ZZ  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Sleep Mode  
Synchronous  
Synchronous  
Synchronous  
DC  
Asynchronous  
N/A  
TMS  
TDI  
Test Mode Select  
Test Data Input  
N/A  
TCK  
TDO  
Test Clock  
N/A  
Test Data Output  
N/A  
0
31  
P1  
P4  
I/O -I/O , I/O -I/O  
Data Input / Output  
Core Power, I/O Power  
Ground  
Synchronous  
N/A  
DD DDQ  
V , V  
Supply  
Supply  
SS  
V
N/A  
5312 tbl 01  
NOTE:  
1. BW3 and BW4 are not applicable for the IDT71V67813.  
JULY 2001  
1
©2000IntegratedDeviceTechnology,Inc.  
DSC-5312/01  

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