是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 208 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.32 |
最长访问时间: | 15 ns | 其他特性: | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码: | S-PBGA-B208 | JESD-609代码: | e1 |
长度: | 15 mm | 内存密度: | 2359296 bit |
内存集成电路类型: | DUAL-PORT SRAM | 内存宽度: | 18 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 208 | 字数: | 131072 words |
字数代码: | 128000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 128KX18 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.45 V |
最小供电电压 (Vsup): | 3.15 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 15 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IDT70V7399S133BFI | IDT |
获取价格 |
HIGH-SPEED 3.3V 128K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7399S133BFI8 | IDT |
获取价格 |
Dual-Port SRAM, 128KX18, 15ns, PBGA208, FBGA-208 | |
IDT70V7399S133DD | IDT |
获取价格 |
HIGH-SPEED 3.3V 128K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7399S133DDG | IDT |
获取价格 |
Dual-Port SRAM, 128KX18, 15ns, PQFP144, TQFP-144 | |
IDT70V7399S133DDGI | IDT |
获取价格 |
暂无描述 | |
IDT70V7399S133DDI | IDT |
获取价格 |
HIGH-SPEED 3.3V 128K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7399S166BC | IDT |
获取价格 |
HIGH-SPEED 3.3V 128K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7399S166BC8 | IDT |
获取价格 |
Dual-Port SRAM, 128KX18, 12ns, PBGA256, BGA-256 | |
IDT70V7399S166BCG | IDT |
获取价格 |
Dual-Port SRAM, 128KX18, 12ns, PBGA256, BGA-256 | |
IDT70V7399S166BCG8 | IDT |
获取价格 |
Dual-Port SRAM, 128KX18, 12ns, PBGA256, BGA-256 |