5秒后页面跳转
IBMN625405GT3B-7N PDF预览

IBMN625405GT3B-7N

更新时间: 2024-02-02 12:35:09
品牌 Logo 应用领域
国际商业机器公司 - IBM 动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
79页 1282K
描述
DDR DRAM, 64MX4, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

IBMN625405GT3B-7N 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2,针数:66
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.33
访问模式:FOUR BANK PAGE BURST最长访问时间:0.75 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G66
长度:22.22 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:4
功能数量:1端口数量:1
端子数量:66字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX4封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL宽度:10.16 mm

IBMN625405GT3B-7N 数据手册

 浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第2页浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第3页浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第4页浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第5页浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第6页浏览型号IBMN625405GT3B-7N的Datasheet PDF文件第7页 
IBMN625404GT3B  
IBMN625804GT3B  
Preliminary  
256Mb Double Data Rate Synchronous DRAM  
Features  
CAS Latency and Frequency  
• DLL aligns DQ and DQS transitions with CK  
transitions, also aligns QFC transitions with CK  
during Read cycles  
Maximum Operating Frequency (MHz)*  
CAS Latency  
DDR266A (7N) DDR266B (75N)  
DDR200 (8N)  
2
133  
143  
100  
133  
100  
125  
• Commands entered on each positive CK edge;  
data and data mask referenced to both edges of  
DQS  
2.5  
* Values are nominal (exact tCK should be used).  
• Burst lengths: 2, 4, or 8  
• Double data rate architecture: two data transfers  
per clock cycle  
• CAS Latency: 2, 2.5  
• Auto Precharge option for each burst access  
• Auto Refresh and Self Refresh Modes  
• Bidirectional data strobe (DQS) is transmitted  
and received with data, to be used in capturing  
data at the receiver  
• 7.8µs Maximum Average Periodic Refresh  
• DQS is edge-aligned with data for reads and is  
center-aligned with data for writes  
Interval  
• Supports t  
lockout feature  
RAS  
• Differential clock inputs (CK and CK)  
• Four internal banks for concurrent operation  
• Data mask (DM) for write data  
• 2.5V (SSTL_2 compatible) I/O  
• V = 2.5V ± 0.2V  
DDQ  
• V = 2.5V ± 0.2V  
DD  
Description  
The 256Mb DDR SDRAM is a high-speed CMOS,  
dynamic random-access memory containing  
268,435,456 bits. It is internally configured as a  
quad-bank DRAM.  
Read and write accesses to the DDR SDRAM are  
burst oriented; accesses start at a selected location  
and continue for a programmed number of locations  
in a programmed sequence. Accesses begin with  
the registration of an Active command, which is then  
followed by a Read or Write command. The address  
bits registered coincident with the Active command  
are used to select the bank and row to be accessed.  
The address bits registered coincident with the  
Read or Write command are used to select the bank  
and the starting column location for the burst  
access.  
The 256Mb DDR SDRAM uses a double-data-rate  
architecture to achieve high-speed operation. The  
double data rate architecture is essentially a 2n  
prefetch architecture with an interface designed to  
transfer two data words per clock cycle at the I/O  
pins. A single read or write access for the 256Mb  
DDR SDRAM effectively consists of a single 2n-bit  
wide, one clock cycle data transfer at the internal  
DRAM core and two corresponding n-bit wide, one-  
half-clock-cycle data transfers at the I/O pins.  
The DDR SDRAM provides for programmable Read  
or Write burst lengths of 2, 4 or 8 locations. An Auto  
Precharge function may be enabled to provide a  
self-timed row precharge that is initiated at the end  
of the burst access.  
A bidirectional data strobe (DQS) is transmitted  
externally, along with data, for use in data capture at  
the receiver. DQS is a strobe transmitted by the  
DDR SDRAM during Reads and by the memory  
controller during Writes. DQS is edge-aligned with  
data for Reads and center-aligned with data for  
Writes.  
As with standard SDRAMs, the pipelined, multibank  
architecture of DDR SDRAMs allows for concurrent  
operation, thereby providing high effective band-  
width by hiding row precharge and activation time.  
The 256Mb DDR SDRAM operates from a differen-  
tial clock (CK and CK; the crossing of CK going high  
and CK going LOW is referred to as the positive  
edge of CK). Commands (address and control sig-  
nals) are registered at every positive edge of CK.  
Input data is registered on both edges of DQS, and  
output data is referenced to both edges of DQS, as  
well as to both edges of CK.  
An auto refresh mode is provided along with a  
power-saving power-down mode. All inputs are  
compatible with the JEDEC Standard for SSTL_2.  
All outputs are SSTL_2, Class II compatible.  
Note: The functionality described and the timing  
specifications included in this data sheet are for  
the DLL Enabled mode of operation.  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
29L0011.E36997B  
1/01  
Page 1 of 79  

与IBMN625405GT3B-7N相关器件

型号 品牌 描述 获取价格 数据表
IBMN625405GT3B-8N IBM DDR DRAM, 64MX4, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格

IBMN625804GT3B-75N IBM DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格

IBMN625804GT3B-7N IBM DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格

IBMN625804GT3B-8N IBM DDR DRAM, 32MX8, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格

IBMN625805GT3B-7N IBM DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格

IBMN625805GT3B-8N IBM DDR DRAM, 32MX8, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

获取价格