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IBM11M2640HB-60T PDF预览

IBM11M2640HB-60T

更新时间: 2024-10-28 15:34:31
品牌 Logo 应用领域
国际商业机器公司 - IBM 动态存储器内存集成电路
页数 文件大小 规格书
26页 304K
描述
Fast Page DRAM Module, 2MX64, 60ns, CMOS, DIMM-168

IBM11M2640HB-60T 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:FAST PAGE最长访问时间:60 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH备用内存宽度:32
I/O 类型:COMMONJESD-30 代码:R-XDMA-N168
内存密度:134217728 bit内存集成电路类型:FAST PAGE DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:168
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX64
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIMM封装等效代码:DIMM168
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:3.3 V认证状态:Not Qualified
刷新周期:2048座面最大高度:25.4 mm
自我刷新:NO最大待机电流:0.008 A
子类别:DRAMs最大压摆率:0.72 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

IBM11M2640HB-60T 数据手册

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Discontinued (9/98 - last order; 3/99 last ship)  
IBM11M2640H2M  
x 6411/10, 5.0V, Au.  
IBM11M2640H  
IBM11M2640HB  
2M x 64 DRAM MODULE  
Features  
• 168 Pin JEDEC Standard, 8 Byte Dual In-line  
Memory Module  
• Optimized for byte-write non-parity applications  
• System Performance Benefits:  
• 2Mx64 Fast Page Mode DIMM  
• Performance:  
- Buffered inputs (except RAS, Data)  
- Reduced noise (32 V /V pins)  
SS CC  
- 4 Byte Interleave enabled  
- Byte write, byte read accesses  
- Buffered PDs  
-60  
-70  
tRAC  
tCAC  
tAA  
RAS Access Time  
60ns  
20ns  
35ns  
70ns  
25ns  
40ns  
CAS Access Time  
• Fast Page Mode, Read-Modify-Write Cycles  
Access Time From Address  
Cycle Time  
• Refresh Modes: RAS-Only, CBR and Hidden  
Refresh  
tRC  
110ns 130ns  
40ns 45ns  
tPC  
Fast Page Mode Cycle Time  
• 2048 refresh cycles distributed across 32ms  
• 11/10 addressing (Row/Column)  
• Card size: 5.25" x 1.0" x 0.157"  
• DRAMS in TSOP Package  
• All inputs and outputs are LVTTL (3.3V) or TTL  
(5.0V) compatible  
• Single 3.3V ± 0.3V or 5V ± 0.5V Power Supply  
• Au contacts  
Description  
IBM11M2640H is an industry standard 168-pin  
8-byte Dual In-line Memory Module (DIMM) which is  
organized as a 2Mx64 high speed memory array for  
non-parity applications. The DIMM uses 8 2Mx8  
DRAMs in TSOP packages.  
be dotted at the system level and activated for each  
DIMM position using the PD enable (PDE) signal. ID  
bits also allow detection of card features, and may  
be dot-or’d at the system level to provide information  
for the entire DIMM bank. For example, if a x64 par-  
ity DIMM were inserted into a bank of x72 parity  
DIMMs, ID0 (grounded) would indicate that at least  
one DIMM in that memory bank is x64, and if the  
memory controller is designed to do so, all DIMMs in  
that memory bank will function as x64s.  
Improved system performance is provided by the  
on-DIMM buffering of selected input signals. The  
specified timings include all buffer, net and skew  
delays, which simplifies the memory subsystem  
design analysis. The data and RAS signals are not  
buffered, which preserves the DRAM access specifi-  
cations of 60ns and 70ns.  
All IBM 168-pin DIMMs provide a high performance,  
flexible 8-byte interface in a 5.25” long space-saving  
footprint. Related products are the x72 parity (5V)  
and ECC DIMMs (5V and 3.3V).  
Presence Detect (PD) and Identification Detect (ID)  
bits provide information about the DIMM density,  
addressing, performance and features. PD bits can  
Card Outline (3.3V)  
Detail A  
(Front)  
(Back)  
1
85  
10 11  
94 95  
84  
168  
40 41  
124 125  
See Detail A  
for 5.0V Version  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
64G1559  
SA14-4612-04  
Revised 5/96  

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