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IBM11M2645H-70 PDF预览

IBM11M2645H-70

更新时间: 2024-10-28 20:10:11
品牌 Logo 应用领域
国际商业机器公司 - IBM 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
29页 351K
描述
EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168

IBM11M2645H-70 技术参数

生命周期:Obsolete包装说明:DIMM, DIMM168
Reach Compliance Code:unknown风险等级:5.84
最长访问时间:70 nsI/O 类型:COMMON
JESD-30 代码:R-PDMA-N168内存密度:134217728 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:64
端子数量:168字数:2097152 words
字数代码:2000000最高工作温度:70 °C
最低工作温度:组织:2MX64
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:DIMM封装等效代码:DIMM168
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:5 V认证状态:Not Qualified
刷新周期:2048座面最大高度:25.4 mm
自我刷新:NO最大待机电流:0.008 A
子类别:DRAMs最大压摆率:0.64 mA
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

IBM11M2645H-70 数据手册

 浏览型号IBM11M2645H-70的Datasheet PDF文件第2页浏览型号IBM11M2645H-70的Datasheet PDF文件第3页浏览型号IBM11M2645H-70的Datasheet PDF文件第4页浏览型号IBM11M2645H-70的Datasheet PDF文件第5页浏览型号IBM11M2645H-70的Datasheet PDF文件第6页浏览型号IBM11M2645H-70的Datasheet PDF文件第7页 
Discontinued (9/98 - last order; 3/99 last ship)  
IBM11M4730C4M  
x 72 E12/10, 5.0V, Au.  
IBM11M2645H  
IBM11M2645HB  
2M x 64 DRAM MODULE  
Features  
• 168 Pin JEDEC Standard, 8 Byte Dual In-line  
Memory Module  
• System Performance Benefits:  
-Buffered inputs (except RAS, Data)  
• 2Mx64 Extended Data Out Page Mode DIMM  
• Performance:  
-Reduced noise (32 V /V pins)  
SS CC  
-4 Byte Interleave enabled  
-Byte write, byte read accesses  
-Buffered PDs  
-60  
-70  
tRAC  
tCAC  
tAA  
RAS Access Time  
CAS Access Time  
Access Time From Address  
Cycle Time  
60ns  
20ns  
35ns  
70ns  
25ns  
40ns  
• Extended Data Out (EDO) Mode, Read-Modify-  
Write Cycles  
• Refresh Modes: RAS-Only, CBR and Hidden  
Refresh  
tRC  
104ns 124ns  
25ns 30ns  
tHPC  
EDO Mode Cycle Time  
• 2048 refresh cycles distributed across 32ms  
• 11/10 addressing (Row/Column)  
• Card size: 5.25" x 1.0" x 0.157"  
• DRAMS in TSOP Package  
• All inputs and outputs are LVTTL (3.3V) or TTL  
(5.0V) compatible  
• Single 3.3V ± 0.3V or 5.0V ± 0.5V Power Supply  
• Au contacts  
• Optimized for byte-write non-parity applications  
Description  
IBM11M2645H is an industry standard 168-pin  
8-byte Dual In-line Memory Module (DIMM) which is  
organized as a 2Mx64 high speed memory array  
designed with EDO DRAMs for non-parity applica-  
tions. The DIMM uses 8 2Mx8 EDO DRAMs in  
TSOP packages. The use of EDO DRAMs allows for  
a reduction in Page Mode Cycle time from 40ns  
(Fast Page) to 25ns for 60ns DRAM modules.  
bits provide information about the DIMM density,  
addressing, performance and features. PD bits can  
be dotted at the system level and activated for each  
DIMM position using the PD enable (PDE) signal. ID  
bits also allow detection of card features, and may  
be dot-or’d at the system level to provide information  
for the entire DIMM bank. For example, if a x64 par-  
ity DIMM were inserted into a bank of x72 parity  
DIMMs, ID0 (grounded) would indicate that at least  
one DIMM in that memory bank is x64, and if the  
memory controller is designed to do so, all DIMMs in  
that memory bank will function as x64s.  
Improved system performance is provided by the  
on-DIMM buffering of selected input signals. The  
specified timings include all buffer, net and skew  
delays, which simplifies the memory subsystem  
design analysis. The data and RAS signals are not  
buffered, which preserves the DRAM access specifi-  
cations of 60ns and 70ns.  
All IBM 168-pin DIMMs provide a high performance,  
flexible 8-byte interface in a 5.25” long space-saving  
footprint. Related products are the x72 parity (5V)  
and ECC DIMMs (5V and 3.3V).  
Presence Detect (PD) and Identification Detect (ID)  
Card Outline (3.3V)  
Detail A  
(Front)  
(Back)  
1
85  
10 11  
94 95  
84  
168  
40 41  
124 125  
See Detail A  
for 5.0V Version  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
50H4197  
SA14-4614-02  
Released 5/96  

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