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HYB18M1G161BF-7.5 PDF预览

HYB18M1G161BF-7.5

更新时间: 2024-02-08 00:15:15
品牌 Logo 应用领域
奇梦达 - QIMONDA 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
65页 3516K
描述
1-Gbit x16 DDR Mobile-RAM

HYB18M1G161BF-7.5 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:DSBGA包装说明:TFBGA, BGA60,9X10,32
针数:60Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.32
风险等级:5.84Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:6.5 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:2,4,8,16
JESD-30 代码:R-PBGA-B60长度:11 mm
内存密度:1073741824 bit内存集成电路类型:DDR DRAM
内存宽度:16湿度敏感等级:3
功能数量:1端口数量:1
端子数量:60字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA60,9X10,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.8 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.07 mm
自我刷新:YES连续突发长度:2,4,8,16
最大待机电流:0.0012 A子类别:DRAMs
最大压摆率:0.27 mA最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:10.5 mm
Base Number Matches:1

HYB18M1G161BF-7.5 数据手册

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Data Sheet  
HY[B/E]18M1G16[0/1]BF  
1-Gbit DDR Mobile-RAM  
1
Overview  
1.1  
Features  
Low power DDR 1Gbit x16 dual die implementation  
Each die organized as 4 banks x 8 MBit x 16  
2 KByte page size  
Two Chip Selects (2 CS) for reducing power consumption  
Options for one CKE and two CKEs are available. Option with second CKE provides futher power saving  
Double-data-rate architecture: two data transfers per clock cycle  
Bidirectional data strobe (DQS) is transmitted / received with data; to be used in capturing data at the receiver  
DQS is edge-aligned with data for READs and center-aligned with data for WRITEs  
Differential clock input (CK / CK)  
Commands entered on positive CK edge; data and mask data are referenced to both edges of DQS  
Four internal banks for concurrent operation  
Programmable CAS latency: 2 and 3  
Programmable burst length: 2, 4, 8 and 16  
Programmable drive strength (full, half, quarter)  
Auto refresh and self refresh modes  
8192 refresh cycles / 64ms  
Auto precharge  
Commercial (-0°C to +70°C) and Extended (-25°C to +85°C) operating temperature ranges  
60-ball PG-VFBGA-60-6 package (11 × 10.5 × 1.0 mm)  
RoHS Compliant Product1)  
Power Saving Features  
Low supply voltages: VDD = 1.70 V 1.90 V, VDDQ = 1.70 V 1.90 V  
Optimized operating (IDD0, IDD4), self refresh (IDD6) and standby currents (IDD2, IDD3  
DDR I/O scheme with no DLL  
Programmable Partial Array Self Refresh (PASR)  
Temperature Compensated Self-Refresh (TCSR), controlled by on-chip temperature sensor  
Clock Stop, Power-Down and Deep Power-Down modes  
)
TABLE 1  
Performance  
Part Number Speed Code  
Clock Frequency (fCKmax  
- 6  
- 7.5  
133  
Unit  
)
CL = 3  
CL = 2  
166  
83  
MHz  
MHz  
ns  
66  
Access Time (tACmax  
)
5.5  
6.5  
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined  
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,  
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.  
Rev.1.0, 2007-03  
3
10242006-Y557-TZXW  

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