HY27US08121A-SIP PDF预览

HY27US08121A-SIP

更新时间: 2025-07-28 13:01:19
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
49页 414K
描述
Flash, 64MX8, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48

HY27US08121A-SIP 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:SOIC包装说明:12 X 17 MM, 0.65 MM HEIGHT, USOP1-48
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.88Is Samacsys:N
最长访问时间:30 ns命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PDSO-G48
JESD-609代码:e0长度:15.4 mm
内存密度:536870912 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:4K端子数量:48
字数:67108864 words字数代码:64000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64MX8
封装主体材料:PLASTIC/EPOXY封装代码:VSSOP
封装等效代码:TSSOP48,.71,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH页面大小:512 words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V编程电压:3.3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:0.65 mm部门规模:16K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO类型:NAND TYPE
宽度:12 mmBase Number Matches:1

HY27US08121A-SIP 数据手册

 浏览型号HY27US08121A-SIP的Datasheet PDF文件第2页浏览型号HY27US08121A-SIP的Datasheet PDF文件第3页浏览型号HY27US08121A-SIP的Datasheet PDF文件第4页浏览型号HY27US08121A-SIP的Datasheet PDF文件第5页浏览型号HY27US08121A-SIP的Datasheet PDF文件第6页浏览型号HY27US08121A-SIP的Datasheet PDF文件第7页 
HY27US(08/16)121A Series  
HY27SS(08/16)121A Series  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash  
Document Title  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date Remark  
Sep. 2004 Preliminary  
0.0  
Initial Draft.  
1) Correct part number ( change mode)  
- 2A -> 1A (sequential row read : disable -> enable)  
2) Correct Table.5 & Table 12  
- Correct Command Set  
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)  
3) Correct Summary description & page.7  
- The cache feature is deleted in summary description.  
- Note.3 is deleted. (page.7)  
0.1  
Oct. 22. 2004 Preliminary  
4) Add System interface using CE don’t care (page. 38)  
5) Change TSOP1, WSOP1,FBGA package dimension & figures.  
- Change TSOP1, WSOP1, FBGA package mechanical data  
- Change TSOP1, WSOP package figures  
6) Correct TSOP1, WSOP1 Pin configuration  
- 38th NC pin has been changed Lockpre (figure 2,3)  
7) Add Bad block Management  
1) LOCKPRE is changed to PRE  
- Texts, Table and figures are changed.  
2) Change Command set  
- Read A,B are changed to Read1.  
- Read C is changed to Read2.  
3) Change AC, DC characterics  
- tRB, tCRY, tCEH and tOH are added.  
4) Correct Program time (max)  
- before : 700us  
0.2  
Mar. 08. 2005 Preliminary  
- after : 500us  
5) Edit figures  
- Address names are changed.  
6) Change FBGA Package Dimension  
- FD1 : 1.70(before) -> 0.90(after)  
Rev 1.3 / Jun. 2006  
1

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HY27US08121A-SPMS HYNIX

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Flash, 64MX8, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48
HY27US08121A-TCB HYNIX

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Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
HY27US08121A-TPCB HYNIX

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Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
HY27US08121A-TPMB HYNIX

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Flash, 64MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
HY27US08121B HYNIX

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512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
HY27US08121B-FIB HYNIX

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Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08121B-FIP HYNIX

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Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08121B-FIS HYNIX

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Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08121B-FPCB HYNIX

获取价格

Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63
HY27US08121B-FPIB HYNIX

获取价格

Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63