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HY27US08121M-FEP PDF预览

HY27US08121M-FEP

更新时间: 2024-11-23 12:58:31
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
49页 414K
描述
Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-68

HY27US08121M-FEP 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-68
针数:68Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.88最长访问时间:12000 ns
JESD-30 代码:R-PBGA-B68长度:15 mm
内存密度:536870912 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:68字数:67108864 words
字数代码:64000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:64MX8封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED编程电压:3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NAND TYPE宽度:8.5 mm
Base Number Matches:1

HY27US08121M-FEP 数据手册

 浏览型号HY27US08121M-FEP的Datasheet PDF文件第2页浏览型号HY27US08121M-FEP的Datasheet PDF文件第3页浏览型号HY27US08121M-FEP的Datasheet PDF文件第4页浏览型号HY27US08121M-FEP的Datasheet PDF文件第5页浏览型号HY27US08121M-FEP的Datasheet PDF文件第6页浏览型号HY27US08121M-FEP的Datasheet PDF文件第7页 
HY27US(08/16)121A Series  
HY27SS(08/16)121A Series  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash  
Document Title  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date Remark  
Sep. 2004 Preliminary  
0.0  
Initial Draft.  
1) Correct part number ( change mode)  
- 2A -> 1A (sequential row read : disable -> enable)  
2) Correct Table.5 & Table 12  
- Correct Command Set  
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)  
3) Correct Summary description & page.7  
- The cache feature is deleted in summary description.  
- Note.3 is deleted. (page.7)  
0.1  
Oct. 22. 2004 Preliminary  
4) Add System interface using CE don’t care (page. 38)  
5) Change TSOP1, WSOP1,FBGA package dimension & figures.  
- Change TSOP1, WSOP1, FBGA package mechanical data  
- Change TSOP1, WSOP package figures  
6) Correct TSOP1, WSOP1 Pin configuration  
- 38th NC pin has been changed Lockpre (figure 2,3)  
7) Add Bad block Management  
1) LOCKPRE is changed to PRE  
- Texts, Table and figures are changed.  
2) Change Command set  
- Read A,B are changed to Read1.  
- Read C is changed to Read2.  
3) Change AC, DC characterics  
- tRB, tCRY, tCEH and tOH are added.  
4) Correct Program time (max)  
- before : 700us  
0.2  
Mar. 08. 2005 Preliminary  
- after : 500us  
5) Edit figures  
- Address names are changed.  
6) Change FBGA Package Dimension  
- FD1 : 1.70(before) -> 0.90(after)  
Rev 1.3 / Jun. 2006  
1

与HY27US08121M-FEP相关器件

型号 品牌 获取价格 描述 数据表
HY27US08121M-FIP HYNIX

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Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-68
HY27US08121M-FIS HYNIX

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Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-68
HY27US08121M-FP HYNIX

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Flash, 64MX8, PBGA63,
HY27US08121M-FPCB HYNIX

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Flash, 64MX8, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPCP HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPCS HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPEB HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPIB HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPIP HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG
HY27US08121M-FPIS HYNIX

获取价格

Flash, 64MX8, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBG