生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | SOP, SOP32,.56 | 针数: | 32 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.84 |
最长访问时间: | 120 ns | JESD-30 代码: | R-PDSO-G32 |
长度: | 20.4978 mm | 内存密度: | 4194304 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 32 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 512KX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP32,.56 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | PARALLEL |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.769 mm | 最大待机电流: | 0.0005 A |
子类别: | MASK ROMs | 最大压摆率: | 0.035 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 宽度: | 11.2015 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HY23V04000S-70 | HYNIX |
获取价格 |
MASK ROM, 512KX8, 70ns, CMOS, PDSO32, 0.500 INCH, PLASTIC, SOP-32 | |
HY23V04200D-100 | HYNIX |
获取价格 |
MASK ROM, 256KX16, 100ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | |
HY23V04200D-120 | HYNIX |
获取价格 |
MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | |
HY23V04200S-70 | HYNIX |
获取价格 |
MASK ROM, 256KX16, 70ns, CMOS, PDSO40, 0.500 INCH, PLASTIC, SOP-40 | |
HY23V08000D-100 | HYNIX |
获取价格 |
MASK ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
HY23V08000D-120 | HYNIX |
获取价格 |
MASK ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
HY23V08000D-70 | HYNIX |
获取价格 |
MASK ROM, 1MX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
HY23V08000S-120 | HYNIX |
获取价格 |
MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.500 INCH, PLASTIC, SOP-32 | |
HY23V08200D-120 | HYNIX |
获取价格 |
MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | |
HY23V08200D-70 | HYNIX |
获取价格 |
MASK ROM, 512KX16, 70ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 |