HY19P03 D/U/V
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
VGSS
TJ
Drain-Source Voltage
-30
±20
V
V
Gate-Source Voltage
Maximum Junction Temperature
Storage Temperature Range
Drain Current-Continuous
150
°C
°C
A
TSTG
IS
-55 to 150
-90
Tc=25°C
Mounted on Large Heat Sink
Tc=25°C
Tc=25°C
Tc=100°C
Tc=25°C
Tc=100°C
-360
-90
A
A
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
-59
A
50
W
PD
Maximum Power Dissipation
20
W
RJC
RJA
EAS
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient **
SinglePulsed-Avalanche Energy ***
2.5
°C/W
°C/W
mJ
110
358***
L=0.3mH
Note:
*
**
Repetitive rating; pulse width limited by max junction temperature.
Surface mounted on FR-4 board.
***
Limited by TJmax , starting TJ=25°C , L = 0.3mH, RG= 25Ω, VGS=10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
HY19P03
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Static Characteristics
VGS=0V,IDS=250uA
BVDSS
Drain-Source Breakdown Voltage
-30
-
-
-
-1
V
VDS=-30V, VGS=0V
TJ=55°C
-
uA
uA
V
IDSS
Drain-to-Source Leakage Current
-
-
-10
-3.0
±100
6
VDS=VGS, IDS=250uA
VGS=±20V,VDS=0V
VGS=-10V,ID= -45A
VGS=-4.5V,ID= -45A
VGS(th)
IGSS
Gate Threshold Voltage
-1.0
-1.7
-
Gate-Source Leakage Current
-
-
nA
mΩ
mΩ
4.8
6.4
RDS(ON)*
Drain-Source On-state Resistance
8
Diode Characteristics
Diode Forward Voltage
ISD= -45A,VGS=0V
-
-
-
-0.82
25
-1.3
V
VSD*
trr
Reverse Recovery Time
Reverse Recovery Charge
-
-
ns
nC
ISD= -45A,dI/dt=100A/us
Qrr
20
V1.1
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