HS-6617RH
Radiation Hardened
2K x 8 CMOS PROM
August 1995
Features
Pinouts
• Total Dose 1 x 105 RAD (Si)
• Latch-Up Free >1 x 1012 RAD (Si)/s
• Field Programmable
24 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T24
TOP VIEW
• Functionally Equivalent to HM-6617
• Pin Compatible with Intel 2716
• Low Standby Power 1.1mW Max
• Low Operating Power 137.5mW/MHz Max
• Fast Access Time 100ns Max
• TTL Compatible Inputs/Outputs
• Synchronous Operation
A7
A6
A5
A4
A3
A2
A1
A0
Q0
1
2
3
4
5
6
7
8
9
24
VDD
23 A8
22 A9
21
20
P
G
19 A10
18
• On Chip Address Latches
E
• Three-State Outputs
17 Q7
16 Q6
15 Q5
14 Q4
13 Q3
• Nicrome Fuse Links
• Easy Microprocessor Interfacing
• Military Temperature Range -55oC to +125oC
Q1 10
Q2 11
Description
GND 12
The Intersil HS-6617RH is a radiation hardened 16K CMOS PROM,
organized in a 2K word by 8-bit format. The chip is manufactured
using a radiation hardened CMOS process, and is designed to be
functionally equivalent to the HM-6617. Synchronous circuit design
techniques combine with CMOS processing to give this device high
speed performance with very low power dissipation.
24 LEAD CERAMIC METAL SEAL FLATPACK
PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F24
TOP VIEW
On chip address latches are provided, allowing easy interfacing with
recent generation microprocessors that use multiplexed address/data
bus structure, such as the HS-80C85RH or HS-80C86RH. The output
enable control (G) simplifies microprocessor system interfacing by
allowing output data bus control, in addition to, the chip enable
control. Synchronous operation of the HS-6617RH is ideal for high
speed pipe-lined architecture systems and also in synchronous logic
replacement functions.
1
24
VDD
A8
A9
P
A7
A6
2
23
22
21
20
19
18
17
16
15
14
13
A5
3
A4
4
G
A3
5
A10
E
A2
6
A1
7
Q7
Q6
Q5
Q4
Q3
A0
8
Q0
Q1
Q2
GND
9
Applications for the HS-6617RH CMOS PROM include low power
microprocessor based instrumentation and communications systems,
remote data acquisition and processing systems, processor control
store, and synchronous logic replacement.
10
11
12
Ordering Information
PART NUMBER
HS1-6617RH-Q
TEMPERATURE RANGE
PACKAGE
24 Lead SBDIP
24 Lead SBDIP
24 Lead SBDIP
24 Lead SBDIP
24 Lead Flatpack
24 Lead Flatpack
24 Lead Flatpack
24 Lead Flatpack
PIN
A
DESCRIPTION
o
o
-55 C to +125 C
Address Input
Data Output
Chip Enable
Output Enable
o
o
HS1-6617RH-8
-55 C to +125 C
Q
o
HS1-6617RH/SAMPLE
HS1-6617RH/PROTO
HS9-6617RH-Q
25 C
E
o
o
-55 C to +125 C
G
o
o
-55 C to +125 C
P
Program Enable (P Hardwired to
VDD, except during programming)
o
o
HS9-6617RH-8
-55 C to +125 C
o
HS9-6617RH/Sample
HS9-6617RH/PROTO
25 C
o
o
-55 C to +125 C
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Spec Number 518742
File Number 3033.3
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
1