Datasheet > HR908-B3555LE

HR908-B3555LE

更新时间： 2024-11-13 02:45:51

品牌	Logo	应用领域
友通 - DFI		/
页数	文件大小	规格书
2页	1040K
描述
3rd/2nd Gen Intel Core COM Express Compact

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中文翻译

获取价格

数据手册

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HR908-B3555LE 数据手册

3rd/2nd Gen Intel^®Core^TM

COM Express^®

Compact

HR908-B

QM67

Features

MEMORY

EXPANSION

1 DDR3/DDR3L SODIMM up to 8GB

1 PCIe x16, 1 PCIe x4, 3 PCIe x1

1 LPC, 1 SMBus, 1 I²C, 2 serial

1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)

8 USB 2.0

BGA 1023

DDR3/DDR3L

SODIMM

4 SATA: 2 SATA 3.0, 2 SATA 2.0

4-bit input and 4-bit output GPIO

1 LAN

Intel QM67

LAN

DIMENSIONS

COM Express^®R2.1 Compact, Type 6

95mm x 95mm (3.74" x 3.74")

CPU Fan

Mechanical Drawing

Block Diagram

91.00

87.00

91.00

87.00

95.00

Top View

Channel A (DDR3)

1066/1333/1600MHz

Channel A (DDR3L)

1066/1333MHz

Processor

CORE CORE CORE CORE

0.00

4.00

0.00

4.00

DDR3/

DDR3L

IMVP7

3^rd/2^ndGeneration

(Vcore,Vgfx)

SODIMM

Intel^®Core™ i7/i5/i3

Ø2.70(*4 pcs)

95.00

PEG 16x LANES

Memory

Controller

Graphics

CORE

DMI

(Direct Media

Interface)

Intel^®FDI

(Flexible Display

Interface)

SM Bus

HD Audio

LPC Bus

DDP Port B/SDVO Port B

DDP Port C

Bottom View

GPIO/

WDT/I²C

DDP Port D

USB 2.0 8x

14.00

PCIe x1 Lane 7

SATA 2.0 2x, SATA 3.0 2x

LVDS (Dual Channel)

2.00

0.00

Mobile Intel^®QM67

(Platform

Controller Hub)

CRT

PCIe x1 6x

SPI

95.00

87.00

53.00

Serial Port 2x

System Fan PWM/TACH_IN

LAN Ports

PCIe x1, Lane 8

Intel^®GLAN

PHY 82579LM

Fan

Heat sink

Heat spreader

Module PCB

standoff

中文翻译

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