3rd/2nd Gen Intel® CoreTM
COM Express®
Compact
HR908-B
QM67
Features
MEMORY
EXPANSION
1 DDR3/DDR3L SODIMM up to 8GB
1 PCIe x16, 1 PCIe x4, 3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
BGA 1023
DDR3/DDR3L
SODIMM
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
Intel QM67
LAN
DIMENSIONS
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
CPU Fan
Mechanical Drawing
Block Diagram
8
9
4
0
.
.
91.00
87.00
91.00
87.00
95.00
Top View
Channel A (DDR3)
1066/1333/1600MHz
Channel A (DDR3L)
1066/1333MHz
Processor
CORE CORE CORE CORE
0.00
4.00
0.00
4.00
7
9
4
0
.
DDR3/
DDR3L
0
IMVP7
3rd/2nd Generation
(Vcore,Vgfx)
SODIMM
Intel® Core™ i7/i5/i3
Ø2.70(*4 pcs)
95.00
PEG 16x LANES
Memory
Controller
Graphics
CORE
DMI
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
SM Bus
HD Audio
LPC Bus
DDP Port B/SDVO Port B
DDP Port C
Bottom View
GPIO/
WDT/I2C
DDP Port D
USB 2.0 8x
14.00
PCIe x1 Lane 7
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
2.00
0.00
Mobile Intel® QM67
(Platform
Controller Hub)
7
1
0
CRT
PCIe x1 6x
SPI
95.00
87.00
53.00
Serial Port 2x
System Fan PWM/TACH_IN
LAN Ports
PCIe x1, Lane 8
Intel® GLAN
PHY 82579LM
Fan
Heat sink
Heat spreader
Module PCB
standoff