Datasheet > HPL5331U5C-TRL

HPL5331U5C-TRL

更新时间： 2024-02-27 12:13:33

品牌	Logo	应用领域
其他 - ETC		稳压器
页数	文件大小	规格书
20页	258K
描述
3A Bus Termination Regulator

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HPL5331U5C-TRL 数据手册

HPL5331

3A Bus Termination Regulator

Features

General Description (Cont.)

On-chip thermal shutdown provides protection against

any combination of overload that would create ex-

cessive junction temperature. The output voltage of

HPL5331 track the voltage at VREF pin. A resistor

divider connected to VIN, GND and VREF pins is

used to provide a half voltage of VIN to VREF pin. In

addition, an external ceramic capacitor and an open-

drain transistor connected to VREF pin provides soft-

start and shutdown control respectively. Pulling and

holding the VREF to GND shuts off the output. The

output of HPL5331 will be high impedance after being

shut down by VREF or thermal shutdown function.

•

Provide Bi-direction Current

- Sourcing or Sinking Current up to 3A

1.25V/0.9V Output for DDR I/II Applications

Fast Transient Response

•

High Output Accuracy

- ±20mV over Load, VOUT Offset and

Temperature

•

Adjustable Output Voltage by External Resistors

Current-Limit Protection

On-Chip Thermal Shutdown

Shutdown for Standby or Suspend Mode

Simple SOP-8, SOP-8-P with thermal pad,

TO-252- 5 and TO-263-5 Packages

Pin Configuration

VOUT

Applications

VCNTL

VIN

GND

VREF

VCNTL

GND

TAB is VCNTL

VREF

VOUT

•

DDR I/II SDRAM Termination

VIN

SSTL-2/3 Termination Voltage

Applications Requiring the Regulator with

SOP-8 (Top View)

TO-252-5 (Top View)

Bi-direction 3A Current Capability

VOUT

VREF

VCNTL

GND

VIN

GND

TAB is VCNTL

VREF

VOUT

VCNTL

General Description

VIN

The HPL5331 linear regulator is designed to provide a

regulated voltage with bi-directional output current for

DDR-SDRAM termination. The HPL5331 integrates

two power transistors to source or sink current up to

3A. It also incorporate current-limit, thermal shutdown

and shutdown control functions into a single chip. Cur-

rent-limit circuit limits the short-circuit current.

SOP-8-P (Top View)

TO-263-5 (Top View)

NC = No internal connection

= Thermal Pad

(connected to GND plane for better heat

dissipation)

 Copyright HIPAC Semiconductor, Inc.

www.hipacsemi.com

Rev. A.8 - Oct., 2003

12 3 4 5 6 7...20

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