Datasheet > HMC855LC5TR

HMC855LC5TR

更新时间： 2024-01-28 23:19:18

品牌	Logo	应用领域
HITTITE		/
页数	文件大小	规格书
8页	542K
描述
Differential Multiplexer

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中文翻译

获取价格

技术参数
数据手册

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HMC855LC5TR 技术参数

生命周期：	Transferred	包装说明：	,
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.76	模拟集成电路 - 其他类型：	DIFFERENTIAL MULTIPLEXER
Base Number Matches：	1

HMC855LC5TR 数据手册

HMC855LC5

v01.0313

28 Gbps, 1:4 DEMUX

w/ PROGRAMMABLE OUTPUT VOLTAGE

Absolute Maximum Ratings

Power Supply Voltage (Vee)

-3.75V to +0.5V

-2V to +0.5V

-1.5V to +0.5V

125 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Input Signals

Output Signals

Junction Temperature

Continuous Pdiss (T = 85 °C)

(derate 33 mW/°C above 85 °C )

1.33 W

Thermal Resistance (R

Worse case device to package paddle

)

th j-p

30 °C/W

Storage Temperature

-65°C to +150°C

-40°C to +85°C

Class 1C

Operating Temperature

ESD Sensitivity (HBM)

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: ALUMINA

2. LEAD AND GROUND PADDLE PLATING:

30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-

6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

7. PADDLE MUST BE SOLDERED TO Vee.

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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中文翻译

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