Data Sheet
HMC637ALP5E
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
5.10
5.00 SQ
4.90
0.30
0.25
0.18
PIN 1
INDICATOR
AREA
PIN 1
TIONS
INDICATOR AR EA OP
(SEE DETAIL A)
25
32
24
1
0.50
BSC
3.80
3.70 SQ
3.60
EXPOSED
PAD
17
8
16
9
0.45
0.40
0.35
0.20 MIN
TOP VIEW
BOTTOM VIEW
3.50 REF
0.90
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4
Figure 23. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm and 0.85 mm Package Height
(HCP-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
MSL Rating2
MSL3
Package Description
Package Option
HCP-32-1
HCP-32-1
HMC637ALP5E
HMC637ALP5ETR
EV1HMC637ALP5
32-Lead Lead Frame Chip Scale Package [LFCSP]
32-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
−40°C to +85°C
MSL3
1 All devices are RoHS compliant.
2 See the Absolute Maximum Ratings section.
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D17308-0-4/19(C)
Rev. C | Page 11 of 11