Datasheet > HMC558LC3BRTR

HMC558LC3BRTR

更新时间： 2024-01-14 09:15:53

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
6页	197K
描述
IC,RF MIXER,GAAS,LLCC,12PIN,CERAMIC

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技术参数
数据手册

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HMC558LC3BRTR 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	风险等级：	5.28
Is Samacsys：	N	安装特点：	SURFACE MOUNT
端子数量：	12	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	CERAMIC
封装等效代码：	LCC12,.12SQ,20	子类别：	RF/Microwave Mixers
表面贴装：	YES	技术：	GAAS
Base Number Matches：	1

HMC558LC3BRTR 数据手册

HMC558LC3B

v02.1208

GaAs MMIC FUNDAMENTAL

MIXER, 5.5 - 14.0 GHz

Absolute Maximum Ratings

RF / IF Input

+25 dBm

LO Drive

+25 dBm

150 °C

Channel Temperature

Continuous Pdiss (T = 85 °C)

(derate 3.25 mW/°C above 85 °C)

211 mW

Thermal Resistance

(channel to ground paddle)

307 °C/W

Storage Temperature

Operating Temperature

-65 to +150 °C

-40 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: ALUMINA.

2. LEAD AND GROUND PADDLE PLATING:

30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.

3. DIMENSIONS ARE IN INCHES (MILLIMETERS).

4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK,

OR LASER MARK LOCATED APPROX. AS SHOWN.

6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C –

7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND.

8. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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