5秒后页面跳转
HLX6228ABF PDF预览

HLX6228ABF

更新时间: 2024-11-04 21:55:59
品牌 Logo 应用领域
其他 - ETC 内存集成电路静态存储器
页数 文件大小 规格书
12页 155K
描述
128K x 8 STATIC RAM?Low Power SOI

HLX6228ABF 数据手册

 浏览型号HLX6228ABF的Datasheet PDF文件第2页浏览型号HLX6228ABF的Datasheet PDF文件第3页浏览型号HLX6228ABF的Datasheet PDF文件第4页浏览型号HLX6228ABF的Datasheet PDF文件第5页浏览型号HLX6228ABF的Datasheet PDF文件第6页浏览型号HLX6228ABF的Datasheet PDF文件第7页 
Military & Space Products  
HLX6228  
128K x 8 STATIC RAM—Low Power SOI  
FEATURES  
RADIATION  
OTHER  
• Fabricated with RICMOSIV Silicon on Insulator  
• Read/Write Cycle Times  
32 ns (-55 to 125°C)  
(SOI) 0.7 µm Low Power Process (Leff = 0.55 µm)  
• Total Dose Hardness through 1x106 rad(Si)  
• Neutron Hardness through 1x1014 cm-2  
• Typical Operating Power <9 mW/MHz  
• JEDEC Standard Low Voltage  
CMOS Compatible I/O  
• Dynamic and Static Transient Upset Hardness  
through 1x109 rad(Si)/s  
• Single 3.3 V 0.3 V Power Supply  
• Asynchronous Operation  
• Dose Rate Survivability through 1x1011 rad(Si)/s  
• Soft Error Rate of <1x10-10 Upsets/bit-day in Geosyn-  
chronous Orbit  
• Packaging Options  
– 32-Lead CFP (0.820 in. x 0.600 in.)  
– 40-Lead CFP (0.775 in. x 0.710 in.)  
• No Latchup  
GENERAL DESCRIPTION  
The 128K x 8 Radiation Hardened Static RAM is a high  
performance 131,072 word x 8-bit static random access  
memory with industry-standard functionality. It is fabricated  
with Honeywell’s radiation hardened technology, and is  
designed for use in low voltage systems operating in radiation  
environments. The RAM operates over the full military  
temperature range and requires only a single 3.3 V 0.3V  
power supply. The RAM is compatible with JEDEC standard  
low voltage CMOS I/O. Power consumption is typically less  
than 9 mW/MHz in operation, and less than 2 mW when de-  
selected.The RAM read operation is fully asynchronous, with  
an associated typical access time of 32 ns at 3.3 V.  
Honeywell’s enhanced SOI RICMOSIV (Radiation Insensi-  
tive CMOS) technology is radiation hardened through the use  
of advanced and proprietary design, layout and process  
hardeningtechniques.TheRICMOSIVlowpowerprocessis  
a SIMOX CMOS technology with a 150 Å gate oxide and a  
minimum drawn feature size of 0.7 µm (0.55 µm effective gate  
length—Leff). Additional features include tungsten via plugs,  
Honeywell’s proprietary SHARP planarization process and a  
lightly doped drain (LDD) structure for improved short channel  
reliability. A 7 transistor (7T) memory cell is used for superior  
single event upset hardening, while three layer metal power  
bussing and the low collection volume SIMOX substrate  
provide improved dose rate hardening.  
Solid State Electronics Center • 12001 State Highway 55, Plymouth, MN 55441 • (800) 323-8295 • http://www.myspaceparts.com  

与HLX6228ABF相关器件

型号 品牌 获取价格 描述 数据表
HLX6228ABH ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228ABN ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228ABR ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228AEF ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228AEH ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228AEN ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228AER ETC

获取价格

128K x 8 STATIC RAM?Low Power SOI
HLX6228AQF ETC

获取价格

x8 SRAM
HLX6228AQH ETC

获取价格

x8 SRAM
HLX6228AQR ETC

获取价格

x8 SRAM