SN74GTLPH16927
18-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
WITH SOURCE-SYNCHRONOUS CLOCK OUTPUTS
SCES413 – OCTOBER 2002
DGG OR DGV PACKAGE
(TOP VIEW)
Member of the Texas Instruments
Widebus Family
TI-OPC Circuitry Limits Ringing on
Unevenly Loaded Backplanes
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56
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DIR
OE
A1
GND
A2
A3
FSTA
BIAS V
B1
GND
B2
2
CC
OEC Circuitry Improves Signal Integrity
and Reduces Electromagnetic Interference
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4
Bidirectional Interface Between GTLP
Signal Levels and LVTTL Logic Levels
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B3
7
V
V
GTLP Buffered SYSCLK Signal (SSCLK) for
Source-Synchronous Applications
CC
REF
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A4
A5
A6
GND
A7
B4
B5
B6
GND
B7
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LVTTL Interfaces Are 5-V Tolerant
Medium-Drive GTLP Outputs (50 mA)
LVTTL Outputs (–24 mA/24 mA)
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GTLP Rise and Fall Times Designed for
Optimal Data-Transfer Rate and Signal
Integrity in Distributed Loads
A8
A9
B8
B9
A10
A11
A12
GND
A13
A14
A15
B10
B11
B12
GND
B13
B14
B15
CMS
B16
B17
GND
B18
SSCLK
I
, Power-Up 3-State, and BIAS V
CC
off
Support Live Insertion
Bus Hold on A-Port Data Inputs
Distributed V
High-Speed Switching Noise
and GND Pins Minimize
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V
CC
A16
A17
GND
A18
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
CLKOUT
CKOE
SYSCLK
description/ordering information
The SN74GTLPH16927 is a medium-drive, 18-bit bus transceiver that provides LVTTL-to-GTLP and
GTLP-to-LVTTL signal-level translation. The device allows for transparent and latched modes of data transfer.
Additionally, with the use of the clock-mode select (CMS) input, the device can be used in source-synchronous
and clock-synchronous applications. Source-synchronous applications require the skew between the clock
output and data output to be minimized for optimum maximum-frequency system performance. In order to
reduce this skew, a flexible setup-time adjustment (FSTA) feature is incorporated into the device that sets a
predetermined delay between the clock and data. The CMS and direction (DIR) inputs control the mode of the
device.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
PACKAGE
TSSOP – DGG
A
Tape and reel
Tape and reel
Tape and reel
SN74GTLPH16927GR
SN74GTLPH16927VR
SN74GTLPH16927KR
GTLPH16927
GL927
–40°C to 85°C TVSOP – DGV
VFBGA – GQL
GL927
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OEC, TI-OPC, and Widebus are trademarks of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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