Datasheet > GT28F008B3TA110

GT28F008B3TA110

更新时间： 2024-11-19 22:14:47

品牌	Logo	应用领域
英特尔 - INTEL		闪存
页数	文件大小	规格书
48页	296K
描述
SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

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中文翻译

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数据手册

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GT28F008B3TA110 数据手册

PRELIMINARY

SMART 3 ADVANCED BOOT BLOCK

4-, 8-, 16-, 32-MBIT

FLASH MEMORY FAMILY

28F400B3, 28F800B3, 28F160B3, 28F320B3

28F008B3, 28F016B3, 28F032B3

Flexible SmartVoltage Technology

Flash Data Integrator Software

Flash Memory Manager

2.7 V–3.6 V Read/Program/Erase

12 V V_PPFast Production

Programming

System Interrupt Manager

Supports Parameter Storage,

Streaming Data (e.g., Voice)

2.7 V or 1.65 V I/O Option

Reduces Overall System Power

Automated Program and Block Erase

Status Registers

High Performance

2.7 V–3.6 V: 90 ns Max Access Time

3.0 V–3.6 V: 80 ns Max Access Time

Extended Cycling Capability

Minimum 100,000 Block Erase

Cycles Guaranteed

Optimized Block Sizes

Eight 8-KB Blocks for Data,

Top or Bottom Locations

Up to Sixty-Three 64-KB Blocks for

Code

Automatic Power Savings Feature

Typical I_CCSafter Bus Inactivity

Standard Surface Mount Packaging

48-Ball µBGA* Package

Block Locking

48-Lead TSOP Package

40-Lead TSOP Package

V_CC-Level Control through WP#

Low Power Consumption

Footprint Upgradeable

Upgrade Path for 4-, 8-, 16-, and 32-

Mbit Densities

10 mA Typical Read Current

Absolute Hardware-Protection

V_PP= GND Option

ETOX™ VI (0.25 µ) Flash Technology

V_CCLockout Voltage

Extended Temperature Operation

–40 °C to +85 °C

The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-

rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability

(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been

added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and

interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single

device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,

monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-

lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be

obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.

July 1998

Order Number: 290580-005

12 3 4 5 6 7...48

中文翻译

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与GT28F008B3TA110相关器件

型号	品牌	获取价格	描述	数据表
GT28F008B3TA90	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3B110	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3B120	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
GT28F016B3B150	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
GT28F016B3B90	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3BA110	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3BA90	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3T110	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
GT28F016B3T120	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
GT28F016B3T150	INTEL	获取价格	SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE

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