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GS832236E-225MT PDF预览

GS832236E-225MT

更新时间: 2024-11-07 04:16:59
品牌 Logo 应用领域
GSI 静态存储器
页数 文件大小 规格书
39页 666K
描述
Cache SRAM, 1MX36, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165

GS832236E-225MT 数据手册

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GS832218/36(B/E)-225M  
GS832272C-225M  
225 MHz  
2M x 18, 1M x 36, 512K x 72  
36Mb S/DCD Sync Burst SRAMs  
119-, 165-, & 209-Pin BGA  
Military Temp  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
either linear or interleave order with the Linear Burst Order (LBO)  
input. The Burst function need not be used. New addresses can be  
loaded on every cycle with no degradation of chip performance.  
Features  
• Military Temperature Range  
• FT pin for user-configurable flow through or pipeline operation  
• Single/Dual Cycle Deselect selectable  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• ZQ mode pin for user-selectable high/low output drive  
• 2.5 V +10%/–10% core power supply  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by the  
user via the FT mode . Holding the FT mode pin low places the  
RAM in Flow Through mode, causing output data to bypass the  
Data Output Register. Holding FT high places the RAM in  
Pipeline mode, activating the rising-edge-triggered Data Output  
Register.  
• 3.3 V +10%/–10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to SCD x18/x36 Interleaved Pipeline mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• Automatic power-down for portable applications  
• JEDEC-standard 119-, 165-, and 209-bump BGA package  
• RoHS-compliant packages available  
SCD and DCD Pipelined Reads  
The GS832218/36/72-225M is a SCD (Single Cycle Deselect) and  
DCD (Dual Cycle Deselect) pipelined synchronous SRAM. DCD  
SRAMs pipeline disable commands to the same degree as read  
commands. SCD SRAMs pipeline deselect commands one stage  
less than read commands. SCD RAMs begin turning off their  
outputs immediately after the deselect command has been  
captured in the input registers. DCD RAMs hold the deselect  
command for one full cycle and then begin turning off their  
outputs just after the second rising edge of clock. The user may  
configure this SRAM for either mode of operation using the SCD  
mode input.  
Functional Description  
Applications  
The GS832218/36/72-225M is a 37,748,736-bit high  
performance synchronous SRAM with a 2-bit burst address  
counter. Although of a type originally developed for Level 2  
Cache applications supporting high performance CPUs, the device  
now finds application in synchronous SRAM applications, ranging  
from DSP main store to networking chip set support.  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write control  
inputs.  
Controls  
Addresses, data I/Os, chip enable (E1), address burst control  
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,  
GW) are synchronous and are controlled by a positive-edge-  
triggered clock input (CK). Output enable (G) and power down  
control (ZZ) are asynchronous inputs. Burst cycles can be initiated  
with either ADSP or ADSC inputs. In Burst mode, subsequent  
burst addresses are generated internally and are controlled by  
ADV. The burst address counter may be configured to count in  
FLXDrive™  
The ZQ pin allows selection between high drive strength (ZQ low)  
for multi-drop bus applications and normal drive strength (ZQ  
floating or high) point-to-point applications. See the Output Driver  
Characteristics chart for details.  
Parameter Synopsis  
-225M  
Unit  
tKQ(x18/x36)  
2.7  
3.0  
4.4  
ns  
ns  
ns  
tKQ(x72)  
Pipeline  
3-1-1-1  
tCycle  
Curr (x18)  
Curr (x36)  
Curr (x72)  
315  
415  
460  
mA  
mA  
mA  
tKQ  
7.0  
7.0  
ns  
ns  
tCycle  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x36)  
Curr (x72)  
230  
325  
360  
mA  
mA  
mA  
Rev: 1.00 1/2011  
1/39  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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