Datasheet > 存储 > SRAM> GS816273C-225I

GS816273C-225I

更新时间： 2024-11-20 03:07:31

品牌	Logo	应用领域
GSI		存储静态存储器
页数	文件大小	规格书
25页	516K
描述
256K x 72 18Mb S/DCD Sync Burst SRAMs

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技术参数
数据手册

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GS816273C-225I 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	14 X 22 MM, 1 MM PITCH, BGA-209
针数：	209	Reach Compliance Code：	unknown
ECCN代码：	3A991.B.2.B	HTS代码：	8542.32.00.41
风险等级：	5.77	最长访问时间：	2.6 ns
其他特性：	PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	JESD-30 代码：	R-PBGA-B209
长度：	22 mm	内存密度：	18874368 bit
内存集成电路类型：	CACHE SRAM	内存宽度：	72
湿度敏感等级：	3	功能数量：	1
端子数量：	209	字数：	262144 words
字数代码：	256000	工作模式：	SYNCHRONOUS
最高工作温度：	85 °C	最低工作温度：	-40 °C
组织：	256KX72	封装主体材料：	PLASTIC/EPOXY
封装代码：	LBGA	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, LOW PROFILE	并行/串行：	PARALLEL
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
座面最大高度：	1.7 mm	最大供电电压 (Vsup)：	2.7 V
最小供电电压 (Vsup)：	2.3 V	标称供电电压 (Vsup)：	2.5 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子形式：	BALL
端子节距：	1 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	14 mm
Base Number Matches：	1

GS816273C-225I 数据手册

GS816273C-250/225

209-Pin BGA

Commercial Temp

Industrial Temp

250 MHz–225 MHz

256K x 72

18Mb S/DCD Sync Burst SRAMs

2.5 V or 3.3 V V

2.5 V or 3.3 V I/O

SCD and DCD Pipelined Reads

Features

The GS816273C is a SCD (Single Cycle Deselect) and DCD

(Dual Cycle Deselect) pipelined synchronous SRAM. DCD

SRAMs pipeline disable commands to the same degree as read

commands. SCD SRAMs pipeline deselect commands one

stage less than read commands. SCD RAMs begin turning off

their outputs immediately after the deselect command has been

captured in the input registers. DCD RAMs hold the deselect

command for one full cycle and then begin turning off their

outputs just after the second rising edge of clock. The user may

configure this SRAM for either mode of operation using the

SCD mode input.

• Single/Dual Cycle Deselect selectable

• IEEE 1149.1 JTAG-compatible Boundary Scan

• ZQ mode pin for user-selectable high/low output drive

• 2.5 or 3.3 V +10%/–10% core power supply

• 2.5 V or 3.3 V I/O supply

• LBO pin for Linear or Interleaved Burst mode

• Internal input resistors on mode pins allow floating mode pins

• Byte Write (BW) and/or Global Write (GW) operation

• Internal self-timed write cycle

• Automatic power-down for portable applications

• JEDEC-standard 209-bump BGA package

Byte Write and Global Write

Functional Description

Byte write operation is performed by using Byte Write enable

(BW) input combined with one or more individual byte write

signals (Bx). In addition, Global Write (GW) is available for

writing all bytes at one time, regardless of the Byte Write

control inputs.

Applications

The GS816273C is an 18,874,368-bit high performance

synchronous SRAM with a 2-bit burst address counter.

Although of a type originally developed for Level 2 Cache

applications supporting high performance CPUs, the device

now finds application in synchronous SRAM applications,

ranging from DSP main store to networking chip set support.

FLXDrive™

The ZQ pin allows selection between high drive strength (ZQ

low) for multi-drop bus applications and normal drive strength

(ZQ floating or high) point-to-point applications. See the

Output Driver Characteristics chart for details.

Controls

Addresses, data I/Os, chip enable (E1), address burst control

inputs (ADSP, ADSC, ADV), and write control inputs (Bx,

BW, GW) are synchronous and are controlled by a positive-

edge-triggered clock input (CK). Output enable (G) and power

down control (ZZ) are asynchronous inputs. Burst cycles can

be initiated with either ADSP or ADSC inputs. In Burst mode,

subsequent burst addresses are generated internally and are

controlled by ADV. The burst address counter may be

configured to count in either linear or interleave order with the

Linear Burst Order (LBO) input. The Burst function need not

be used. New addresses can be loaded on every cycle with no

degradation of chip performance.

Sleep Mode

Low power (Sleep mode) is attained through the assertion

(High) of the ZZ signal, or by stopping the clock (CK).

Memory data is retained during Sleep mode.

Core and Interface Voltages

The GS816273C operates on a 2.5 V or 3.3 V power supply.

All input are 3.3 V and 2.5 V compatible. Separate output

power (V

) pins are used to decouple output noise from the

DDQ

internal circuits and are 3.3 V and 2.5 V compatible.

Parameter Synopsis

-250

-225

Unit

Pipeline

3-1-1-1

2.6

4.0

2.6

4.5

tCycle

3.3 V

2.5 V

Curr (x72)

430

410

400

375

Rev: 1.03 7/2004

1/25

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

12 3 4 5 6 7...25

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与GS816273C-225I相关器件

型号	品牌	获取价格	描述	数据表
GS816273C-225IT	GSI	获取价格	Cache SRAM, 256KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
GS816273C-225T	GSI	获取价格	Cache SRAM, 256KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
GS816273C-250	GSI	获取价格	256K x 72 18Mb S/DCD Sync Burst SRAMs
GS816273C-250I	GSI	获取价格	256K x 72 18Mb S/DCD Sync Burst SRAMs
GS816273C-250IT	GSI	获取价格	Cache SRAM, 256KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
GS816273CC	GSI	获取价格	256K x 72 18Mb S/DCD Sync Burst SRAMs
GS816273CC-150	GSI	获取价格	209 BGA
GS816273CC-150I	GSI	获取价格	209 BGA
GS816273CC-150IV	GSI	获取价格	209 BGA
GS816273CC-150V	GSI	获取价格	209 BGA

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