GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
100-Pin TQFP & 165-Bump BGA
Commercial Temp
Industrial Temp
250 MHz–150 MHz
1M x 18, 512K x 36, 512K x 36
18Mb Sync Burst SRAMs
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Features
• FT pin for user-configurable flow through or pipeline operation
• Dual Cycle Deselect (DCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP package
• RoHS-compliant 100-lead TQFP and 165-bump BGA packages
available
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
DCD Pipelined Reads
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
is a DCD (Dual Cycle Deselect) pipelined synchronous
SRAM. SCD (Single Cycle Deselect) versions are also
available. DCD SRAMs pipeline disable commands to the
same degree as read commands. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock.
Functional Description
Applications
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
is a 18,874,368-bit high performance synchronous SRAM with
a 2-bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main
store to networking chip set support.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Controls
Sleep Mode
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,
BW, GW) are synchronous and are controlled by a positive-
edge-triggered clock input (CK). Output enable (G) and power
down control (ZZ) are asynchronous inputs. Burst cycles can
be initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V
and 2.5 V compatible. Separate output power (V
) pins are
DDQ
used to decouple output noise from the internal circuits and are
3.3 V and 2.5 V compatible.
Parameter Synopsis
-250
-200
-150
Unit
tKQ
2.5
4.0
3.0
5.0
3.8
6.7
ns
ns
tCycle
Pipeline
3-1-1-1
295
345
245
285
200
225
mA
mA
Curr (x18)
Curr (x32/x36)
tKQ
tCycle
5.5
5.5
6.5
6.5
7.5
7.5
ns
ns
Flow Through
2-1-1-1
225
255
200
220
185
205
mA
mA
Curr (x18)
Curr (x32/x36)
Rev: 1.03 9/2005
1/35
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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