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GS4576C18GL-33I PDF预览

GS4576C18GL-33I

更新时间: 2024-11-06 21:13:03
品牌 Logo 应用领域
GSI 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
62页 2381K
描述
DDR DRAM, 32MX18, CMOS, PBGA144, ROHS COMPLIANT, UBGA-144

GS4576C18GL-33I 技术参数

是否Rohs认证: 符合生命周期:End Of Life
零件包装代码:BGA包装说明:TFBGA,
针数:144Reach Compliance Code:compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.32
风险等级:5.21访问模式:MULTI BANK PAGE BURST
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B144
长度:18.5 mm内存密度:603979776 bit
内存集成电路类型:DDR DRAM内存宽度:18
功能数量:1端口数量:1
端子数量:144字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32MX18封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:11 mm
Base Number Matches:1

GS4576C18GL-33I 数据手册

 浏览型号GS4576C18GL-33I的Datasheet PDF文件第2页浏览型号GS4576C18GL-33I的Datasheet PDF文件第3页浏览型号GS4576C18GL-33I的Datasheet PDF文件第4页浏览型号GS4576C18GL-33I的Datasheet PDF文件第5页浏览型号GS4576C18GL-33I的Datasheet PDF文件第6页浏览型号GS4576C18GL-33I的Datasheet PDF文件第7页 
GS4576C09/18/36L  
533 MHz300 MHz  
144-Ball BGA  
Commercial Temp  
Industrial Temp  
64M x 9, 32M x 18, 16M x 36  
576Mb CIO Low Latency DRAM (LLDRAM II)  
2.5 V VEXT  
1.8 V VDD  
1.5 V or 1.8 V VDDQ  
Features  
Introduction  
• Pin- and function-compatible with Micron RLDRAM® II  
• 533 MHz DDR operation (1.067Gb/s/pin data rate)  
• 38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency)  
• 16M x 36, 32M x 18, and 64M x 9 organizations available  
• 8 banks  
• Reduced cycle time (15 ns at 533 MHz)  
• Address Multiplexing (Nonmultiplexed address option  
available)  
• SRAM-type interface  
• Programmable Read Latency (RL), row cycle time, and burst  
sequence length  
• Balanced Read and Write Latencies in order to optimize data  
bus utilization  
The GSI Technology 576Mb Low Latency DRAM  
(LLDRAM II) is a high speed memory device designed for  
high address rate data processing typically found in networking  
and telecommunications applications. The 8-bank architecture  
and low tRC allows access rates formerly only found in  
SRAMs.  
The Double Data Rate (DDR) I/O interface provides high  
bandwidth data transfers, clocking out two beats of data per  
clock cycle at the I/O balls. Source-synchronous clocking can  
be implemented on the host device with the provided free-  
running data output clock.  
• Data mask for Write commands  
Commands, addresses, and control signals are single data rate  
signals clocked in by the True differential input clock  
transition, while input data is clocked in on both crossings of  
the input data clock(s).  
• Differential input clocks (CK, CK)  
• Differential input data clocks (DKx, DKx)  
• On-chip DLL generates CK edge-aligned data and output  
data clock signals  
• Data valid signal (QVLD)  
Read and Write data transfers always in short bursts. The burst  
length is programmable to 2, 4 or 8 by setting the Mode  
Register.  
• 32 ms refresh (16K refresh for each bank; 128K refresh  
command must be issued in total each 32 ms)  
• 144-ball BGA package  
• HSTL I/O (1.5 V or 1.8 V nominal)  
The device is supplied with 2.5 V V  
and 1.8 V V for the  
EXT DD  
• 25–60matched impedance outputs  
core, and 1.5 V or 1.8 V for the HSTL output drivers.  
• 2.5 V V , 1.8 V V , 1.5 V or 1.8 V V I/O  
DDQ  
EXT  
DD  
• On-die termination (ODT) R  
Internally generated row addresses facilitate bank-scheduled  
refresh.  
TT  
• Commerical and Industrial Temperature  
Commercial (+0° T +95°C)  
C
The device is delivered in an efficent BGA 144-ball package.  
Industrial (–40° T +95°C)  
C
Rev: 1.04 11/2013  
1/62  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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