Datasheet > GMZJ9.1

GMZJ9.1

更新时间： 2024-10-28 03:08:43

品牌	Logo	应用领域
强茂 - PANJIT		二极管齐纳二极管
页数	文件大小	规格书
5页	159K
描述
SURFACE MOUNT ZENER DIODES

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中文翻译

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数据手册

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GMZJ9.1 数据手册

DATA SHEET

GMZJ2.0~GMZJ56

SURFACE MOUNT ZENER DIODES

Unit : inch (mm)

MICRO-MELF

VOLTAGE

POWER

500 mWatts

2.0 to 56 Volts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• Both normal and Pb free product are available :

Normal : 80~95% Sn, 5~20% Pb

Pb free: 98.5% Sn above

.008(0.2)

.043(1.1)

.008(0.2)

MECHANICAL DATA

.079(2.0)

.071(1.8)

• Case: Molded Glass MICRO-MELF

• Terminals: Solderable per MIL-STD-202E, Method 208

• Polarity: See Diagram Below

• Approx. Weight: 0.01 grams

• Mounting Position: Any

•

Packing information

T/R - 2.5K per 7" plastic Reel

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at Tamb = 25 ^OC

Symbol

Value

500

Units

TOT

Junction Temperature

175

^OC

Storage Temperature Range

-65 to +175

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

Parameter

Symbol

RthA

Min.

Typ.

Max.

Units

Thermal Resistance Junction to Ambient Air

0.3

K/mW

Forward Voltage at IF = 100mA

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

STAD-SEP.14.2004

PAGE . 1

12 3 4 5

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