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GLZ8.2C PDF预览

GLZ8.2C

更新时间: 2024-11-05 10:42:43
品牌 Logo 应用领域
强茂 - PANJIT 二极管齐纳二极管
页数 文件大小 规格书
5页 101K
描述
SURFACE MOUNT ZENER DIODES

GLZ8.2C 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:MELF
包装说明:O-LELF-R2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.52
Is Samacsys:N外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:8 Ω
JESD-30 代码:O-LELF-R2元件数量:1
端子数量:2最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:GLASS
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:0.5 W认证状态:Not Qualified
标称参考电压:8.2 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子形式:WRAP AROUND端子位置:END
处于峰值回流温度下的最长时间:NOT SPECIFIED最大电压容差:2.55%
工作测试电流:20 mABase Number Matches:1

GLZ8.2C 数据手册

 浏览型号GLZ8.2C的Datasheet PDF文件第2页浏览型号GLZ8.2C的Datasheet PDF文件第3页浏览型号GLZ8.2C的Datasheet PDF文件第4页浏览型号GLZ8.2C的Datasheet PDF文件第5页 
GLZ2.0~GLZ56  
SURFACE MOUNT ZENER DIODES  
Unit : inch (mm)  
MINI-MELF/LL-34  
VOLTAGE  
POWER  
500 mWatts  
2.0 to 56 Volts  
FEATURES  
• Planar Die construction  
• 500mW Power Dissipation  
• Ideally Suited for Automated Assembly Processes  
• In compliance with EU RoHS 2002/95/EC directives  
MECHANICAL DATA  
• Case: Molded Glass MINI-MELF  
.020(0.5)  
.012(0.3)  
.020(0.5)  
.012(0.3)  
• Terminals: Solderable per MIL-STD-750, Method 2026  
• Polarity: See Diagram Below  
.146(3.7)  
.130(3.3)  
• Approx. Weight: 0.01 ounces, 0.03 grams.  
• Mounting Position: Any  
• Packing information  
T/R - 2.5K per 7" plastic Reel  
T/R - 10K per 13" plastic Reel  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Parameter  
Power Dissipation at Tamb = 25 OC  
Symbol  
Value  
500  
Units  
W
P
TOT  
Junction Temperature  
-55 to + 175  
-65 to + 175  
OC  
OC  
T
J
Storage Temperature Range  
TSTG  
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Thermal Resistance Junction to Ambient Air  
--  
0.3  
1
K/mW  
RthA  
--  
Forward Voltage at IF = 100mA  
--  
V
VF  
--  
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.  
STAD-JUL.30.2009  
PAGE . 1  

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