Datasheet > GLZ9.1B

GLZ9.1B

更新时间： 2024-11-06 10:42:43

品牌	Logo	应用领域
强茂 - PANJIT		二极管齐纳二极管
页数	文件大小	规格书
5页	101K
描述
SURFACE MOUNT ZENER DIODES

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数据手册

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GLZ9.1B 数据手册

GLZ2.0~GLZ56

SURFACE MOUNT ZENER DIODES

Unit : inch (mm)

MINI-MELF/LL-34

VOLTAGE

POWER

500 mWatts

2.0 to 56 Volts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

.020(0.5)

.012(0.3)

.020(0.5)

.012(0.3)

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

.146(3.7)

.130(3.3)

• Approx. Weight: 0.01 ounces, 0.03 grams.

• Mounting Position: Any

• Packing information

T/R - 2.5K per 7" plastic Reel

T/R - 10K per 13" plastic Reel

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at Tamb = 25 ^OC

Symbol

Value

500

Units

TOT

Junction Temperature

-55 to + 175

-65 to + 175

^OC

Storage Temperature Range

TSTG

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

Parameter

Symbol

Min.

Typ.

Max.

Units

Thermal Resistance Junction to Ambient Air

0.3

K/mW

RthA

Forward Voltage at IF = 100mA

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

STAD-JUL.30.2009

PAGE . 1

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