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GF4126 PDF预览

GF4126

更新时间: 2024-01-08 19:47:41
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
5页 155K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 20V V(BR)DSS | 7.2A I(D) | SO

GF4126 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.92配置:Single
最大漏极电流 (Abs) (ID):7.2 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2.5 W子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
Base Number Matches:1

GF4126 数据手册

 浏览型号GF4126的Datasheet PDF文件第2页浏览型号GF4126的Datasheet PDF文件第3页浏览型号GF4126的Datasheet PDF文件第4页浏览型号GF4126的Datasheet PDF文件第5页 
GF4126  
N-Channel Enhancement-Mode MOSFET  
Low V  
V
DS  
20V R  
30mI 7.2A  
GS(th)  
DS(ON)  
D
SO-8  
0.197 (5.00)  
0.189 (4.80)  
5
8
1
0.157 (3.99)  
0.150 (3.81)  
0.244 (6.20)  
0.228 (5.79)  
0.05 (1.27)  
0.04 (1.02)  
Dimensions in inches  
and (millimeters)  
4
0.165 (4.19)  
0.155 (3.94)  
0.245 (6.22)  
Min.  
0.019 (0.48)  
x 45°  
0.020 (0.51)  
0.013 (0.33)  
0.010 (0.25)  
0.009 (0.23)  
0.007 (0.18)  
0.050 (1.27)  
0.035 (0.889)  
0.025 (0.635)  
0.050 typ.  
(1.27)  
0.069 (1.75)  
0.053 (1.35)  
Mounting Pad Layout  
0.050(1.27)  
0.016 (0.41)  
0°8°  
0.009 (0.23)  
0.004 (0.10)  
Mechanical Data  
Features  
Case: SO-8 molded plastic body  
• Advanced Trench Process Technology  
• High Density Cell Design for Ultra Low  
On-Resistance  
Terminals: Leads solderable per MIL-STD-750,  
Method 2026  
• Fast Switching  
High temperature soldering guaranteed:  
250°C/10 seconds at terminals  
• Logic Level  
• Ideal for DC/DC converters  
Mounting Position: Any  
Weight: 0.5g  
Maximum Ratings and Thermal Characteristics(TA = 25°C unless otherwise noted)  
Parameter  
Symbol  
VDS  
VGS  
ID  
Limit  
Unit  
Drain-Source Voltage  
20  
V
±
Gate-Source Voltage  
12  
Continuous Drain Current at TJ = 150°C(1), TA = 25°C  
Pulsed Drain Current  
7.2  
20  
A
IDM  
TA = 25°C  
Maximum Power Dissipation(1)  
TA = 70°C  
2.5  
1.6  
PD  
W
Operating Junction and Storage Temperature Range  
Maximum Junction-to-Ambient(1) Thermal Resistance  
TJ, Tstg  
RθJA  
–55 to 150  
50  
°C  
°C/W  
7/10/01  

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