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GDPXA250B2C400 PDF预览

GDPXA250B2C400

更新时间: 2024-02-05 15:50:09
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
46页 675K
描述
Multifunction Peripheral, CMOS, PBGA256, MBGA-256

GDPXA250B2C400 技术参数

生命周期:Obsolete包装说明:BGA,
Reach Compliance Code:unknown地址总线宽度:26
边界扫描:YES总线兼容性:I2C; I2S; IRDA; UART; USB
外部数据总线宽度:32JESD-30 代码:S-PBGA-B256
长度:17 mmI/O 线路数量:81
端子数量:256最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY座面最大高度:2 mm
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM宽度:17 mm
Base Number Matches:1

GDPXA250B2C400 数据手册

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Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for  
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.  
The Intel® PXA250 and PXA210 Applications Processors may contain design defects or errors known as errata which may cause the product to  
deviate from published specifications. Current characterized errata are available on request.  
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2
Datasheet  

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